A semiconductor light emitting package includes a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor light emitting package, comprising: a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting device; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.
2. The semiconductor light emitting package according to claim 1 , further comprising an electrode layer disposed on the base.
3. The semiconductor light emitting package according to claim 1 , wherein each of the optical members is formed of a resin material.
4. The semiconductor light emitting package according to claim 1 , further comprising a heat sink combined with the base.
5. The semiconductor light emitting package according to claim 1 , wherein the base is formed of a metal.
6. A light emitting unit, comprising: at least one semiconductor light emitting package, each including: a base having a top surface with a flat portion, the base shaped into a substantially circle; a plurality of semiconductor light emitting devices on the base; an electrical circuit layer electrically connected to the plurality of semiconductor light emitting devices; a plurality of screen members on the base; and a plurality of optical members formed of a light transmissive material such that light emitted from at least one of the semiconductor light emitting devices passes therethrough, wherein each of the screen members has an opening surrounding at least one of the semiconductor light emitting device, each opening of the screen members is shaped into a substantially circle, a diameter of the base is larger than a diameter of the opening of the screen members, and an edge portion of the optical members is in contact with one of the screen members.
7. The light emitting unit according to claim 6 , further comprising an electrode layer disposed on the base.
8. The light emitting unit according to claim 6 , wherein each of the optical members is formed of a resin material.
9. The light emitting unit according to claim 6 , further comprising a heat sink combined with the base.
10. The light emitting unit according to claim 6 , wherein the base is formed of a metal.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 13, 2011
March 13, 2012
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