Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A microstructure comprising: a spacer layer which is selectively formed over a protective substrate, and a layer which is formed over the spacer layer, wherein: the layer includes a fixed portion formed over the spacer layer and a movable portion below which the spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically, a space is provided between the movable portion of the layer and the protective substrate, and the protective substrate is a light-transmitting substrate.
2. A microstructure comprising a first spacer layer which is selectively formed over a first protective substrate, a first layer formed over the first spacer layer, a second spacer layer which is selectively formed over the first layer, and a second protective substrate formed over the second spacer layer, wherein: the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically, a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and the first protective substrate is a light-transmitting substrate.
3. The microstructure according to claim 2 , wherein the second protective substrate includes a third layer which is formed so as to face the first layer.
4. The microstructure according to claim 2 , wherein the space is filled with air.
5. The microstructure according to claim 2 , wherein the first protective substrate includes a second layer which is formed so as to face the first layer.
6. A micromachine comprising: an electric circuit formed over a protective substrate; and a microstructure which is electrically connected to the electric circuit, wherein: the electric circuit includes a spacer layer which is selectively formed over the protective substrate and a layer formed over the spacer layer, the layer includes a fixed portion provided over the spacer layer and a movable portion below which the spacer layer is not provided, and the fixed portion and the movable portion are at least partially connected physically, a space is provided between the movable portion of the layer and the protective substrate, and the protective substrate is a flexible substrate.
7. The micromachine according to claim 6 , wherein the space is filled with air.
8. A micromachine comprising: an electric circuit formed over a first protective substrate; and a microstructure which is electrically connected to the electric circuit, wherein: the electric circuit includes a semiconductor element, the microstructure includes a first spacer layer which is selectively formed over the first protective substrate, a first layer formed over the first spacer layer, a second spacer layer which is selectively formed over the first layer, and a second protective substrate formed over the second spacer layer, the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically, a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and the first protective substrate is a flexible substrate.
9. The micromachine according to claim 8 , wherein the space is filled with air.
10. The microstructure according to claim 1 , wherein the protective substrate is a flexible substrate.
11. The microstructure according to claim 2 , wherein the first protective substrate is a flexible substrate.
12. The micromachine according to claim 6 , wherein the protective substrate is a light-transmitting substrate.
13. The micromachine according to claim 8 , wherein the first protective substrate is a light-transmitting substrate.
14. The microstructure according to claim 2 , wherein the first spacer layer is an adhesive having conductivity in a perpendicular direction to the first protective substrate surface.
15. The micromachine according to claim 8 , wherein the first spacer layer is an adhesive having conductivity in a perpendicular direction to the first protective substrate surface.
16. The micromachine according to claim 8 , wherein the first protective substrate includes a second layer which is formed so as to face the first layer, and the second layer includes a conductive material.
17. The micromachine according to claim 8 , wherein the first spacer layer includes a material which is different from that of the first layer.
18. The microstructure according to claim 2 , wherein the movable portion is displaced in a direction perpendicular to the first protective substrate.
19. The microstructure according to claim 2 , wherein the movable portion is displaced in a direction parallel to the first protective substrate.
20. The micromachine according to claim 6 , wherein the movable portion is displaced in a direction perpendicular to the protective substrate.
21. The micromachine according to claim 6 , wherein the movable portion is displaced in a direction parallel to the protective substrate.
22. The micromachine according to claim 8 , wherein the movable portion is displaced in a direction perpendicular to the first protective substrate.
23. The micromachine according to claim 8 , wherein the movable portion is displaced in a direction parallel to the first protective substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 14, 2007
March 20, 2012
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