Method and system for process optimization

1. A computer-implemented method for process optimization after mask manufacturing comprising: generating a first list of critical areas simulated from a manufactured mask containing a design layout based at least in part upon cross domain correlation, wherein the cross domain correlation comprises correlating the critical areas caused by physical and electrical effects with weighing factors from a manufacturer, wherein the weighting factors are tuned to match locations of actual critical areas of a previous layout with locations of simulated critical areas of the same previous layout; applying a priority for process optimization for the critical areas; determining, by using a processor, a manufacturing process recipe based at least in part upon the priority, wherein the manufacturing process recipe is determined based at least in part upon comparing a prediction of functional and parametric yields with a threshold in order to optimize a process control for the functional and parametric yields; and storing the manufacturing process recipe in a volatile or non-volatile computer-usable medium or displaying the manufacturing process recipe using a display device.

2. The method of claim 1 , further comprising updating process settings of a combined process window if a production yield is below a threshold.

3. The method of claim 2 , wherein the act of updating comprises generating a second list of critical areas associated with the combined process window.

4. The method of claim 1 , further comprising providing the manufacturing process recipe to be used for fabrication if a product yield is above a threshold.

5. The method of claim 1 , wherein process window information and parametric effects information are used for the determining of the first list of critical areas, wherein process window information comprises possible critical areas determined by a process window and parametric effects information comprises possible critical areas determined by electrical effects.

6. The method of claim 1 , further comprising optimizing a mask if a production yield is below a required value.

7. The method of claim 1 , wherein the critical areas are determined by prioritizing hot spots based at least in part upon production yield.

8. An apparatus for process optimization after mask manufacturing comprising: a processor configured for: generating a first list of critical areas simulated from a manufactured mask containing a design layout based at least in part upon cross domain correlation, wherein the cross domain correlation comprises correlating the critical areas caused by physical and electrical effects with weighing factors from a manufacturer, wherein the weighting factors are tuned to match locations of actual critical areas of a previous layout with locations of simulated critical areas of the same previous layout; applying a priority for process optimization for the critical areas; determining a manufacturing process recipe based at least in part upon the priority, wherein the manufacturing process recipe is determined based at least in part upon comparing a prediction of functional and parametric yields with a threshold in order to optimize a process control for the functional and parametric yields; and a volatile or non-volatile computer-usable medium for storing the manufacturing process recipe or a display device for displaying the manufacturing process recipe.

9. The apparatus of claim 8 , further comprising means for updating process settings of a combined process window if a production yield is below a threshold.

10. The apparatus of claim 9 , wherein the means for updating comprises means for generating a second list of critical areas associated with the combined process window.

11. The apparatus of claim 8 , further comprising means for providing the manufacturing process recipe to be used for fabrication if a product yield is above a threshold.

12. The apparatus of claim 8 , wherein process window information and parametric effects information are used for the determining of the first list of critical areas, wherein process window information comprises possible critical areas determined by a process window and parametric effects information comprises possible critical areas determined by electrical effects.

13. The apparatus of claim 8 , further comprising means for optimizing a mask if a production yield is below a required value.

14. The apparatus of claim 8 , wherein the critical areas are determined by prioritizing hot spots based at least in part upon production yield.

15. A computer program product comprising a non-transitory computer-usable storage medium having executable code which, when executed by a processor, causes the processor to execute a process for process optimization after mask manufacturing, comprising: generating a first list of critical areas simulated from a manufactured mask containing a design layout based at least in part upon cross domain correlation, wherein the cross domain correlation comprises correlating the critical areas caused by physical and electrical effects with weighing factors from a manufacturer, wherein the weighting factors are tuned to match locations of actual critical areas of a previous layout with locations of simulated critical areas of the same previous layout; applying a priority for process optimization for the critical areas; and determining a manufacturing process recipe based at least in part upon the priority, wherein the manufacturing process recipe is determined based at least in part upon comparing a prediction of functional and parametric yields with a threshold in order to optimize a process control for the functional and parametric yields; and storing the manufacturing process recipe or displaying the manufacturing process recipe on a display device.

16. The computer program product of claim 15 , further comprising updating process settings of a combined process window if a production yield is below a threshold.

17. The computer program product of claim 16 , wherein the act of updating comprises generating a second list of critical areas associated with the combined process window.

18. The computer program product of claim 15 , further comprising providing the manufacturing process recipe to be used for fabrication if a product yield is above a threshold.

19. The computer program product of claim 15 , wherein process window information and parametric effects information are used for the determining of the first list of critical areas, wherein process window information comprises possible critical areas determined by a process window and parametric effects information comprises possible critical areas determined by electrical effects.

20. The computer program product of claim 15 , further comprising optimizing a mask if a production yield is below a required value.

21. The computer program product of claim 15 , wherein the critical areas are determined by prioritizing hot spots based at least in part upon production yield.