An embedded touch display panel including a first substrate and a second substrate is provided. The first substrate having a displaying region and a sensing region includes a stack structure, a first conductive layer and a first alignment layer. The stack structure disposed on the first substrate within the sensing region includes a protruding structure and a first rough structure disposed on the protruding structure. The first conductive layer conformally disposed on the stack structure has a first rough surface. The first rough surface is exposed from the first alignment layer that covers the first conductive layer. The second substrate includes a second conductive layer and a second alignment layer. The second conductive layer whose position corresponds to the sensing region is disposed on the second structure. A portion of the second conductive layer corresponding to the first rough surface is exposed from the second alignment layer covering thereon.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An embedded touch display panel, comprising: a first substrate having a displaying region and a sensing region, wherein the first substrate comprises: a stack structure disposed on the first substrate within the sensing region, wherein the stack structure comprises a protruding structure and a first rough structure disposed on the protruding structure; a first conductive layer disposed on the first substrate within the sensing region and conformally disposed on the stack structure, wherein the first conductive layer has a first rough surface; and a first alignment layer covering the first conductive layer, wherein the first rough surface of the first conductive layer is exposed from the first alignment layer; a second substrate correspondingly disposed on one side of the first substrate, wherein the second substrate comprises: a second conductive layer whose position corresponds to the sensing region, wherein the second conductive layer is disposed on the second substrate; and a second alignment layer covering the second conductive layer, wherein a portion of the second conductive layer whose position corresponds to the first rough surface of the first conductive layer is exposed from the second alignment layer; and a liquid crystal layer disposed between the first substrate and the second substrate.
2. The embedded touch display panel according to claim 1 , wherein the protruding structure comprises a sensing protrusion.
3. The embedded touch display panel according to claim 2 , wherein the protruding structure and the first rough structure are made from the same material.
4. The embedded touch display panel according to claim 1 , wherein the first rough structure has a plurality of slots such that the first conductive layer has the first rough surface.
5. The embedded touch display panel according to claim 1 , wherein the first rough structure has a plurality of protrusions such that the first conductive layer has the first rough surface.
6. The embedded touch display panel according to claim 1 , further comprising: a spacer disposed between the first substrate and the second substrate such that the first substrate and the second substrate are separated by a distance.
7. The embedded touch display panel according to claim 1 , wherein the exposed portion of the second conductive layer has a second rough surface.
8. The embedded touch display panel according to claim 7 , wherein the second substrate further comprises: a second rough structure disposed on the side of the second conductive layer opposite to the first substrate and corresponding to the second rough surface.
9. A touch substrate applicable to an embedded touch display panel, comprising: a base having a displaying region and a sensing region; a rough structure disposed on the base within the sensing region; a conductive layer conformally disposed on the rough structure and having a rough surface; and an alignment layer disposed on the conductive layer, wherein the rough surface of the conductive layer is exposed from the alignment layer that covers the base and the conductive layer.
10. The touch substrate according to claim 9 , wherein the rough structure has a plurality of slots such that the conductive layer has the rough surface.
11. The touch substrate according to claim 9 , wherein the rough structure has a plurality of protrusions such that the conductive layer has the rough surface.
12. The touch substrate according to claim 9 , wherein the rough structure comprises: a patterned metal layer disposed between the base and the conductive layer, wherein the patterned metal layer has a first pattern.
13. The touch substrate according to claim 12 , wherein the rough structure further comprises: a patterned semiconductor layer disposed between the patterned metal layer and the conductive layer, wherein the patterned semiconductor layer has a second pattern.
14. The touch substrate according to claim 9 , further comprising: a protruding structure disposed between the rough structure and the base.
15. The touch substrate according to claim 14 , wherein the protruding structure comprises a sensing protrusion.
16. The touch substrate according to claim 15 , wherein the protruding structure and the rough structure are made from the same material.
17. A method of manufacturing touch substrate applicable to an embedded touch display panel, the method comprising: providing a base having a displaying region and a sensing region; forming a rough structure on the base within the sensing region; conformally forming a conductive layer on the rough structure, wherein the conductive layer disposed on the rough structure has a rough surface; and forming an alignment layer on the conductive layer by the rubbing process and exposing a portion of the rough surface.
18. The manufacturing method according to claim 17 , wherein the step of forming rough structure comprises: forming a metal layer on the base; and patterning the metal layer within the sensing region to form a patterned metal layer.
19. The manufacturing method according to claim 18 , further comprising: forming a semiconductor layer on the patterned metal layer; and patterning the semiconductor layer within the sensing region to form a patterned semiconductor layer.
20. The manufacturing method according to claim 17 , wherein the step of forming the rough structure comprises: forming a plurality of slots, wherein the extending direction of the slots is substantially perpendicular to the rubbing direction of the alignment layer.
21. The manufacturing method according to claim 20 , wherein the step of forming a plurality of slots comprises: performing exposure by a mask having a plurality of slits.
22. The manufacturing method according to claim 20 , wherein the step of forming a plurality of slots comprises: performing exposure by a mask having at least two different light transmittances.
23. The manufacturing method according to claim 17 , wherein the step of forming the rough structure comprises: forming a plurality of protrusions, wherein the extending direction of the protrusions is substantially perpendicular to the rubbing direction of the alignment layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 5, 2009
April 17, 2012
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