An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A camera module comprising: a substrate; an image sensor chip disposed on and electrically connected to the substrate; a transparent cover, the transparent cover being an infrared filter; a lens module mounted on the substrate via an adhesive layer, the lens module comprising: a bottom surface contacting with the substrate, the bottom surface defining at least one sloped surface, wherein at least one gap is defined between the substrate and the at least one sloped surface, the adhesive layer being disposed between the bottom surface and the substrate; the gap is capable of accepting adhesive when the lens module and the substrate are pressed together, the lens module also comprises a lens holder, a lens barrel, and a lens group, the lens holder comprises a top hollow cylinder and a bottom hollow cylinder, the bottom surface is located on the bottom hollow cylinder and the image sensor chip is received in the bottom hollow cylinder, the lens barrel and the lens group are received in the lens barrel, the combined lens barrel and lens group are received in the top hollow cylinder, the lens barrel comprises a lower surface facing the image sensor chip, the transparent cover is secured to the lower surface of the lens barrel by another adhesive layer.
2. The camera module as claimed in claim 1 , wherein the lens module further comprises a outer sidewall, the at least one sloped surface extending from the bottom surface to the outer sidewall.
3. The camera module as claimed in claim 1 , wherein the lens module further comprises a inner sidewall, the sloped surface extending from the bottom surface to the inner sidewall.
4. The camera module as claimed in claim 1 , wherein the gap is triangular, or a trapeziform in shape.
5. The camera module as claimed in claim 1 , wherein the profile of the bottom surface is “V” in shape.
6. The camera module as claimed in claim 1 , wherein the lens module further comprises an inner sidewall and an outer sidewall, the bottom surface defines an inner sloped surface extending from the bottom surface to the inner sidewall, and an outer sloped surfaces extending from the bottom surface to the outer sidewall, a first gap is defined between the substrate and the inner sloped surface, a second gap is defined between the substrate and the outer sloped surface.
7. The camera module as claimed in claim 1 , wherein the image sensor chip comprises a photosensitive area on the substrate, and a non-photosensitive area surrounding the photosensitive area, the non-photosensitive area comprises a number of chip pads, the substrate comprises a plurality of base pads, each base pad is electrically connected to a corresponding chip pad via a conductive wire.
8. The camera module as claimed in claim 1 , wherein the image sensor chip is mechanically and electrically connected to the substrate by chip-scale, wafer-level chip-scale, ceramic leaded, plastic leadless chip, thermal compression bonding, or a flip chip packaging processes.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 18, 2009
April 24, 2012
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