A semiconductor device capable of reducing an inductance is provided. In the semiconductor device in which a rectification MOSFET, a commutation MOSFET, and a driving IC that drives these MOSFETs are mounted on one package, the rectification MOSFET, a metal plate, and the commutation MOSFET are laminated. A current of a main circuit flows from a back surface of the package to a front surface thereof. The metal plate is connected to an output terminal via a wiring in the package. Wire bondings are used for wirings for connecting the driving IC, the rectification MOSFET, and the commutation MOSFET, all terminals being placed on the same plane. For this reason, the inductance becomes small and also a power source loss and a spike voltage are reduced.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device formed on one package and including a rectification MOSFET, a commutation MOSFET, and a driver IC for driving the rectification MOSFET and the commutation MOSFET, the semiconductor device comprising: an input terminal (Vin); an output terminal (Vout); a ground terminal (Gnd); a metal plate that laminates the rectification MOSFET and the commutation MOSFET; a gate terminal of the rectification MOSFET; a gate terminal of the commutation MOSFET; and a terminal electrically connected to the output terminal (Vout), wherein the gate terminal of the rectification MOSFET, the gate terminal of the commutation MOSFET, and the terminal electrically connected to the output terminal (Vout) are provided on the driver IC side of the semiconductor device.
2. The semiconductor device according to claim 1 , wherein: a wire from the gate terminal of the rectification MOSFET, a wire from the gate terminal of the commutation MOSFET, and a wire from the terminal electrically connected to the output terminal (Vout) are provided adjoiningly to each other.
3. The semiconductor device according to claim 1 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a source electrode of the rectification MOSFET.
4. The semiconductor device according to claim 3 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a drain electrode of the commutation MOSFET.
5. The semiconductor device according to claim 1 , wherein: the metal plate is arranged on the rectification MOSFET, and the commutation MOSFET is arranged on the metal plate.
6. A semiconductor device formed on one package and including a rectification MOSFET, a commutation MOSFET, and a driver IC for driving the rectification MOSFET and the commutation MOSFET, the semiconductor device comprising: an input terminal (Vin); an output terminal (Vout); a ground terminal (Gnd); a metal plate that laminates the rectification MOSFET and the commutation MOSFET; a gate terminal of the rectification MOSFET; a gate terminal of the commutation MOSFET; and a terminal electrically connected to the output terminal (Vout), wherein a wire from the gate terminal of the rectification MOSFET and a wire from the terminal electrically connected to the output terminal (Vout) are provided adjoiningly to each other.
7. The semiconductor device according to claim 6 , wherein: the gate terminal of the rectification MOSFET, the gate terminal of the commutation MOSFET, and the terminal electrically connected to the output terminal (Vout) are provided on the driver IC side of the semiconductor device.
8. The semiconductor device according to claim 6 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a source electrode of the rectification MOSFET.
9. The semiconductor device according to claim 8 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a drain electrode of the commutation MOSFET.
10. The semiconductor device according to claim 6 , wherein: the metal plate is arranged on the rectification MOSFET, and the commutation MOSFET is arranged on the metal plate.
11. A semiconductor device formed on one package and including a rectification MOSFET, a commutation MOSFET, and a driver IC for driving the rectification MOSFET and the commutation MOSFET, the semiconductor device comprising: an input terminal (Vin); an output terminal (Vout); a ground terminal (Gnd); a metal plate that laminates the rectification MOSFET and the commutation MOSFET; a gate terminal of the rectification MOSFET; a gate terminal of the commutation MOSFET; and a terminal electrically connected to the output terminal (Vout), wherein a wire from the terminal electrically connected to the output terminal (Vout) is provided between a wire from the gate terminal of the rectification MOSFET and a wire from the gate terminal of the commutation MOSFET.
12. The semiconductor device according to claim 11 , wherein: the gate terminal of the rectification MOSFET, the gate terminal of the commutation MOSFET, and the terminal electrically connected to the output terminal (Vout) are provided on the driver IC side of the semiconductor device.
13. The semiconductor device according to claim 11 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a source electrode of the rectification MOSFET.
14. The semiconductor device according to claim 13 , wherein: a voltage of the terminal electrically connected to the output terminal (Vout) has the same potential as that of a drain electrode of the commutation MOSFET.
15. The semiconductor device according to claim 11 , wherein: the metal plate is arranged on the rectification MOSFET, and the commutation MOSFET is arranged on the metal plate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 23, 2011
August 7, 2012
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