This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without passing the energy on to the electronic device component. To maximize the effectiveness of the boundary element over a range of different impacts (e.g., strong, instantaneous impacts and weak impacts over time), a viscoelastic material may be used. The characteristic properties of the viscoelastic material may be selected based on expected impacts to the electronic device component.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for reducing shocks received by an electronic device component, comprising: providing the electronic device component within an electronic device housing; and defining a shell surrounding the electronic device component, the shell being fully contained within the electronic device housing, the shell comprising: a first layer enclosing at least in part the electronic device component, the first layer located adjacent to the electronic device component and constructed from a visco-elastic material that provides shock protection of a first characteristic for the component, the first characteristic including both viscous and elastic responses; and a second layer completely enclosing the first layer, the second layer directly interfaces with the first layer and constructed from an elastic material that provides shock protection of a second characteristic for the component, the second characteristic including an elastic response; wherein the combination of the first and second layers reduces the effects of shock events of varying magnitudes to the component.
2. The method of claim 1 , wherein the electronic device component is operative to move in at least one direction within the shell.
3. The method of claim 1 , further comprising: determining the impact for which protection of the component is to be optimized; and selecting a viscoelastic material for which strain rate is less than a maximum value for the stress associated with the determined impact.
4. The method of claim 3 , wherein the viscoelastic material is operative to deform in response to a force being applied to the electronic device.
5. An electronic device with shock protection for components, comprising: a housing; at least one component placed within the housing, the at least one component operative to deflect in response to a force being applied to the housing; and a boundary component placed around at least a portion of the at least one component, the boundary component comprising: a first layer enclosing at least in part the at least one component, the first layer located adjacent to the electronic device component and constructed from a visco-elastic material that provides shock protection of a first characteristic for the component, the first characteristic including both viscous and elastic responses; and a second layer completely enclosing the first layer, the second layer directly interfaces with the first layer and constructed from an elastic material that provides shock protection of a second characteristic for the component, the second characteristic including an elastic response; wherein the combination of the first and second layers reduces the effects of shock events of varying magnitudes to the component.
6. The electronic device of claim 5 , wherein the boundary component is positioned adjacent to the at least one component.
7. The electronic device of claim 6 , wherein the boundary component is positioned such that the at least one component is operative to deflect into the boundary component in response to the force being applied to the housing.
8. The electronic device of claim 5 , wherein the boundary component is at least one of an amorphous polymer, a semicrystalline polymer, a biopolymer, and bitumen material.
9. The electronic device of claim 5 , wherein the relationship between stress and strain rate of the boundary component is optimized for at least two different levels of forces applied to the housing.
10. The electronic device of claim 9 , wherein the relationship between stress and strain rate of the boundary component is non-linear.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 30, 2008
August 21, 2012
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