An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A film-like adhesive used for bonding a semiconductor element to an adherend, wherein the film-like adhesive has an adhesive layer comprising a polyurethaneimide-polyurethaneamideimide resin, and wherein the polyurethaneimide-polyurethaneamideimide resin comprises a polymer having: (1) a partial structure represented by a formula (1a) shown below: [wherein, R 1a represents a bivalent organic group comprising either an aromatic ring, or a straight-chain, branched or cyclic aliphatic hydrocarbon, R 2a represents a bivalent organic group with a molecular weight within a range from 100 to 10,000, R 3a represents a tetravalent organic group containing a total number of carbon atoms of 4 or greater, and n 1a represents an integer from 1 to 100], and (2) a partial structure represented by a formula (1b) shown below: [wherein, R 1b represents a bivalent organic group containing either an aromatic ring, or a straight-chain, branched or cyclic aliphatic hydrocarbon, R 2b represents a bivalent organic group with a molecular weight within a range from 100 to 10,000, R 3b represents a trivalent organic group containing a total number of carbon atoms of 4 or greater, and n 1b represents an integer from 1 to 100].
2. The film-like adhesive according to claim 1 , wherein the polyurethaneimide-polyurethaneamideimide resin comprises a block copolymer produced by subjecting a urethane oligomer having terminal isocyanate groups, generated by a reaction between a diisocyanate and a diol, to a chain extension using a tetracarboxylic dianhydride and a tricarboxylic anhydride.
3. The film-like adhesive according to claim 2 , wherein the diisocyanate comprises a compound represented by a formula (10) shown below.
5. The film-like adhesive according to claim 2 , wherein the tetracarboxylic dianhydride comprises a compound represented by a formula (30) shown below.
6. The film-like adhesive according to claim 2 , wherein the tricarboxylic anhydride comprises a compound represented by a formula (40) shown below.
7. The film-like adhesive according to claim 1 , wherein a weight average molecular weight of the polyurethaneimide-polyurethaneamideimide resin is within a range from 10,000 to 300,000.
8. The film-like adhesive according to claim 1 , wherein a main dispersion peak temperature in a dynamic viscoelasticity measurement of the adhesive layer is within a range from −100 to 50° C.
9. The film-like adhesive according to claim 1 , wherein a storage elastic modulus at 20° C. in a dynamic viscoelasticity measurement of the adhesive layer is no more than 1,000 MPa.
10. The film-like adhesive according to claim 1 , wherein a flow amount for the adhesive layer when subjected to pressurization at 9.8 MPa for 90 seconds while being heated at 180° C. is within a range from 50 to 2,000 μm.
11. The film-like adhesive according to claim 1 , wherein a flow amount for the adhesive layer when heated for one hour at 180° C., and subsequently subjected to pressurization at 9.8 MPa for 90 seconds while being heated at 180° C., is within a range from 50 to 2,000 μm.
12. The film-like adhesive according to claim 2 , wherein a ratio between the tetracarboxylic dianhydride and the tricarboxylic anhydride, where a sum thereof is 1.0 mol, is 0.05 to 0.95 mol of the tetracarboxylic dianhydride and 0.95 to 0.05 mol of the tricarboxylic anhydride.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 4, 2006
October 23, 2012
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