Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A laser processing apparatus that processes a subject on which a low-k material is formed, the laser processing apparatus comprising: a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject, wherein the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region.
2. The laser processing apparatus of claim 1 , wherein each of the laser beams that have passed through the optical system is shaped to have an elliptical shape by a cylindrical lens, before being irradiated onto the subject.
3. A laser processing apparatus that processes a subject on which a low-k material is formed, the laser processing apparatus comprising: a laser generating unit that emits a laser beam; a beam splitting unit that splits the laser beam emitted from the laser generating unit into two; an optical system that splits a first laser beam split by the beam splitting unit into two, such that the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region, and irradiates the split laser beams onto the subject; and a mirror that receives a second laser beam split by the beam splitting unit and allows the second laser beam to be irradiated onto the low-k material between the two edges, wherein the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other.
4. The laser processing apparatus of claim 3 , wherein an aperture of the second laser beam is the same as the interval between the two edges.
5. The laser processing apparatus of claim 3 , wherein the beam splitting unit includes a prism module that splits an incident laser beam into two.
6. The laser processing apparatus of claim 3 , wherein the mirror is composed of a polygon mirror.
7. The laser processing apparatus of claim 3 , wherein the mirror is composed of a polygon mirror of which the number of reflection surfaces is controlled, such that an aperture of the laser beam covers a plurality of reflection surfaces of the polygon mirror.
8. A laser processing apparatus that processes a subject on which a low-k material is formed, the laser processing apparatus comprising: a first laser generating unit that emits a laser beam; an optical system that splits the laser beam emitted from the first laser generating unit into two, such that the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region, and allows the split laser beams to be incident on the subject; a second laser generating unit that emits a laser beam; and a mirror that allows the laser beam emitted from the second laser generating unit to be irradiated onto the low-k material between the two edges, wherein the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other.
9. The laser processing apparatus of claim 8 , wherein the second laser generating unit is driven the predetermined time after the first laser generating unit is driven.
10. The laser processing apparatus of claim 8 , wherein an aperture of the laser beam that is emitted from the second laser generating unit is controlled to be the same as the interval between the two edges.
11. The laser processing apparatus of claim 8 , wherein the mirror is composed of a polygon mirror.
12. The laser processing apparatus of claim 8 , wherein the mirror is composed of a polygon mirror of which the number of reflection surfaces is controlled, such that an aperture of the laser beam covers a plurality of reflection surfaces of the polygon mirror.
13. A laser processing apparatus that processes a subject on which a low-k material is formed, the laser processing apparatus comprising: a laser generating unit that emits a laser beam; a first laser beam splitting unit that splits the laser beam emitted from the laser generating unit into two; a second laser beam splitting unit that splits a first laser beam emitted from the first laser beam splitting unit into two and irradiates the split laser beams onto two edges of the low-k material in a removal subject region; and a third laser beam splitting unit that splits a second laser beam emitted from the first laser beam splitting unit into at least two and irradiates the splits laser beams onto a region between the edges of the removal subject region.
14. The laser processing apparatus of claim 13 , wherein the laser beams that are split into at least two by the third laser beam splitting unit are arranged in a direction vertical to a processing direction of the subject.
15. The laser processing apparatus of claim 13 , wherein each of the first to third laser beam splitting units includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other.
16. The laser processing apparatus of claim 13 , wherein each of the first to third laser beam splitting units includes a prism module that splits an incident laser beam into two.
17. The laser processing apparatus of claim 13 or 16 , wherein each of the first to third laser beam splitting units includes: a first mirror that reflects an incident laser beam; a prism module that splits the laser beam reflected on the first mirror into two; and a second mirror that reflects the laser beams split into two by the prism module.
18. The laser processing apparatus of claim 13 , wherein each of the first to third laser beam splitting units includes a beam splitter that splits an incident laser beam into two.
19. The laser processing apparatus of claim 13 or 18 , wherein each of the first to third laser beam splitting units includes: a beam splitter that splits an incident laser beam into two; a polarizer that converts a polarization characteristic of a first laser beam reflected on the beam splitter; a first mirror that reflects a second laser beam transmitted through the beam splitter, a second mirror that reflects a second laser beam reflected on the first mirror, and a polarized beam splitter that reflects the first laser beam whose polarization characteristic has been converted by the polarizer and transmits the second laser beam reflected on the second mirror.
20. The laser processing apparatus of claim 13 , wherein the third beam splitting unit includes: a beam splitter that splits an incident laser beam into two; and a prism module that splits one of the laser beams split into two by the beam splitter into two.
21. The laser processing apparatus of claim 13 or 20 , wherein the third beam splitting unit includes: a beam splitter that splits an incident laser beam into two; a polarizer that converts a polarization characteristic of the laser beam reflected on the beam splitter; a prism module that splits the laser beam whose polarization characteristic has been converted by the polarizer into first and second laser beams; a first mirror that reflects a third laser beam transmitted through the beam splitter; a second mirror that reflects the third laser beam reflected on the first mirror; and a polarized beam splitter that reflects the first and second laser beams emitted from the prism module and transmits the third laser beam incident through the second mirror.
22. The laser processing apparatus of claim 13 , wherein the third beam splitting unit includes: a prism module that splits an incident laser beam into two; and a beam splitter that splits each of the laser beams split into two by the prism module into two.
23. The laser processing apparatus of claim 13 , wherein the third beam splitting unit includes: a prism module that splits an incident laser beam into two; a beam splitter that splits each of the laser beams split into two by the prism module into two and reflects and transmits the split laser beams; a polarizer that converts polarization characteristics of first and second laser beams reflected on the beam splitter; a first mirror that reflects third and fourth laser beams transmitted through the beam splitter; a second mirror that reflects the laser beam reflected on the first mirror; and a polarized beam splitter that, reflects the first and second laser beams whose polarization characteristics have been converted by the polarizer and transmits the third and fourth laser beams incident through the second mirror.
24. The laser processing apparatus of any one of claims 16 , 20 , and 22 , wherein the prism module includes: a first prism that splits an incident laser beam into two; and a second prism that changes directions of the laser beams split by the first prism such that the laser beams are parallel to each other.
25. The laser processing apparatus of claim 13 , further comprising: a cylindrical lens that shapes a sectional shape of the laser beam into an elliptical shape before the laser beam is irradiated onto the subject.
26. A laser processing apparatus that processes a subject on which a low-k material is formed, the laser processing apparatus comprising: a first laser generating unit that emits a laser beam; a first laser beam splitting unit that splits the laser beam emitted from the first laser generating unit into two and irradiates the laser beams onto edges of a removal subject region of the low-k material at both sides; a second laser generating unit that emits a laser beam; and a second laser beam splitting unit that splits a second laser beam emitted from the second laser generating unit into at least two and irradiates the split laser beams onto a region between the edges of the removal subject region.
27. The laser processing apparatus of claim 26 , wherein the laser beams that are split into at least two by the second laser beam splitting unit are arranged in a direction vertical to a processing direction of the subject.
28. The laser processing apparatus of claim 26 , wherein each of the first and second laser beam splitting units includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other.
29. The laser processing apparatus of claim 26 , wherein each of the first and second laser beam splitting units includes a prism module that splits an incident laser beam into two.
30. The laser processing apparatus of claim 26 or 29 , wherein each of the first and second laser beam splitting units includes: a first mirror that reflects an incident laser beam; a prism module that splits the laser beam reflected on the first mirror into two; and a second mirror that reflects the laser beams split into two by the prism module.
31. The laser processing apparatus of claim 26 , wherein each of the first and second laser beam splitting units includes a beam splitter that splits an incident laser beam into two.
32. The laser processing apparatus of claim 26 or 31 , wherein each of the first and second laser beam splitting units includes: a beam splitter that splits an incident laser beam into two; a polarizer that converts a polarization characteristic of a first laser beam reflected on the beam splitter; a first mirror that reflects a second laser beam transmitted through the beam splitter; a second mirror that reflects the second laser beam reflected on the first mirror; and a polarized beam splitter that reflects the first laser beam whose polarization characteristic has been converted by the polarizer and transmits the second laser beam reflected on the second mirror.
33. The laser processing apparatus of claim 26 , wherein the second beam splitting unit includes: a beam splitter that splits an incident laser beam into two; and a prism module that splits one of the laser beams split into two by the beam splitter into two.
34. The laser processing apparatus of claim 26 or 33 , wherein the second beam splitting unit includes: a beam splitter that splits an incident laser beam into two; a polarizer that converts a polarization characteristic of the laser beam reflected on the beam splitter; a prism module that splits the laser beam whose polarization characteristic has been converted by the polarizer into first and second laser beams; a first mirror that reflects a third laser beam transmitted through the beam splitter; a second mirror that reflects the third laser beam reflected on the first mirror, and a polarized beam splitter that reflects the first and second laser beams emitted from the prism module and transmits the third laser beam incident through the second mirror.
35. The laser processing apparatus of claim 26 , wherein the second beam splitting unit includes: a prism module that splits an incident laser beam into two; and a beam splitter that splits each of the laser beams split into two by the prism module into two.
36. The laser processing apparatus of claim 26 or 35 , wherein the second beam splitting unit includes: a prism module that splits an incident laser beam into two; a beam splitter that splits each of the laser beams split into two by the prism module into two and reflects and transmits the split laser beams; a polarizer that converts polarization characteristics of first and second laser beams reflected on the beam splitter; a first mirror that reflects third and fourth laser beams transmitted through the beam splitter; a second mirror that reflects the laser beam reflected on the first mirror; and a polarized beam splitter that reflects the first and second laser beams whose polarization characteristics have been converted by the polarizer and transmits the third and fourth laser beams incident through the second mirror.
37. The laser processing apparatus of any one of claims 29 , 33 , and 35 , wherein the prism module includes: a first prism that splits an incident laser beam into two; and a second prism that changes directions of the laser beams split by the first prism such that the laser beams are parallel to each other.
38. The laser processing apparatus of claim 26 , further comprising: a cylindrical lens that shapes a sectional shape of the laser beam into an elliptical shape before the laser beam is irradiated onto the subject.
39. A laser processing method that processes a subject on which a low-k material is formed, the laser processing method comprising: a first step of providing an optical system, which includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other; a second step of setting processing parameters, which include locations of edges of the low-k material in a removal subject region, an interval between the edges, and output power of a laser beam; a third step of emitting a laser beam; a fourth step of splitting the laser beam into two using the optical system; and a fifth step of irradiating the two split laser beams onto the two edges of the low-k material in the removal subject region.
40. The laser processing method of claim 39 , further comprising: being performed between the third step and the fourth step, a (3-1)-th step of splitting the laser beam into first and second laser beams and allowing the first laser beam to be incident on the optical system; and a (3-2)-th step of irradiating the second laser beam onto a region between the two edges.
41. The laser processing method of claim 40 , wherein the aperture of the second laser beam is controlled to be the same as the interval between the two edges.
42. A laser processing method that processes a subject on which a low-k material is formed, the laser processing method comprising: a first step of providing an optical system, which includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other; a second step of setting processing parameters, which include locations of edges of the low-k material in a removal subject region, an interval between the edges, and output power of a laser beam; a third step of emitting a first laser beam; a fourth step of splitting the first laser beam emitted in the third step into two using the optical system; a fifth step of irradiating the laser beams split into two in the fourth step onto the two edges of the low-k material in the removal subject region; a sixth step of emitting a second laser beam; and a seventh step of irradiating the second laser beam emitted in the sixth step onto a region between the two edges.
43. The laser processing method of claim 42 , wherein an aperture of the second laser beam is controlled to be the same as the interval between the two edges.
44. A laser processing method that processes a subject on which a low-k material is formed, the laser processing method comprising: a first step of setting processing parameters, which include locations of edges of the low-k material in a removal subject region, an interval between the edges, and output power of a laser beam; a second step of emitting a laser beam; a third step of splitting the laser beam into two; a fourth step of splitting a first laser beam between the laser beams split into two in the third step into two and irradiating the split laser beams onto edges of the low-k material in the removal subject region at both sides; and a fifth step of splitting a second laser beam between the laser beams split into two in the third step into at least two and irradiating the split laser beams onto portions between the edges of the low-k material in the removal subject region.
45. The laser processing method of claim 44 , further comprising: after the second step, moving the subject in a direction opposite to a processing direction.
46. A laser processing method that processes a subject on which a low-k material is formed, the laser processing method comprising: a first step of setting processing parameters, which include locations of edges of the low-k material in a removal subject region, an interval between the edges, and output power of a laser beam; a second step of emitting a first laser beam; a third step of splitting the first laser beam emitted in the second step into two and irradiating the split laser beams onto edges of the low-k material in the removal subject region at both sides; a fourth step of emitting a second laser beam; and a fifth step of splitting the second laser beam emitted in the fourth step into two and irradiating the split laser beams onto a portion between the edges of the low-k material in the removal subject region.
47. The laser processing method of claim 44 , further comprising: after the second step or the fourth step, moving the subject in a direction opposite to a processing direction.
48. The laser processing method of claim 44 or 46 , wherein the at least two split laser beams that are irradiated onto the portions between the two edges of the low-k material in the removal subject region are arranged in a direction vertical to the processing direction of the subject.
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May 6, 2008
December 11, 2012
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