A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method comprising: dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole, wherein the adhesive agent comprises a hydrocarbon resin, the stripping solution is one hydrocarbon-based solvent or a mixture of a plurality of hydrocarbon-based solvents, and the stripping solution has a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater of the adhesive agent.
2. The method of claim 1 , wherein the stripping solution is the one hydrocarbon-based solvent, and the one hydrocarbon-based solvent comprises a single hydrocarbon compound.
3. The method of claim 1 , wherein the one hydrocarbon-based solvent comprises a mixture of hydrocarbon compounds.
4. The method of claim 1 , wherein the stripping solution is the mixture of the plurality of hydrocarbon-based solvents, and at least one of the plurality of hydrocarbon-based solvents has a viscosity of 0.5 mPa·s or less.
5. The method of claim 1 , wherein the stripping solution is the mixture of the plurality of hydrocarbon-based solvents, each of the plurality of hydrocarbon-based solvents has a viscosity of 1.0 mPa·s or less and a dissolving rate of 30 nm/sec or greater of the adhesive agent, and at least one of the plurality of hydrocarbon-based solvents has a viscosity of 0.5 mPa·s or less.
6. The method of claim 1 , wherein a plurality of the through holes are provided on the supporting plate with intervals of 500 μm or less therebetween.
7. The method of claim 1 , wherein the stripping solution is the mixture of the plurality of hydrocarbon-based solvents, each of the plurality of hydrocarbon-based solvents has a viscosity of 1.3 mPa·s of less, and a dissolving rate of 30 nm/sec or greater of the adhesive agent, and at least one of the plurality of hydrocarbon-based solvents has a viscosity of 0.5 mPa·s or less.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 31, 2011
December 18, 2012
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