A coil-integrated switching power supply module that provides an improved heat radiation effect to keep the temperature of the entire coil-integrated switching power supply module to a lower value includes a thermal diffusion conductor pattern arranged around a hole through which a magnetic core extends on a layer. The thermal diffusion conductor pattern continuously extends in areas where coil conductor patterns are located on other layers and outside areas where the coil conductor patterns are located on the other layers. In addition, the thermal diffusion conductor pattern includes slits at portions thereof and does not define a closed loop around the hole through which the magnetic core extends.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A coil-integrated switching power supply module comprising: a multilayer substrate in which spiral coil conductor patterns are provided on multiple layers, holes are located at an inner side and an outer side of each of the coil conductor patterns, and circuit element mounting electrodes are located on outer surfaces of the multilayer substrate; a magnetic core that extends through the holes located at the inner side and the outer side of each of the coil conductor patterns of the multilayer substrate to define a closed magnetic circuit; and circuit elements mounted on the circuit element mounting electrodes; wherein a thermal diffusion conductor pattern is located on an inner layer of the multilayer substrate, the thermal diffusion conductor pattern continuously extends in areas where the coil conductor patterns are located and outside the areas where the coil conductor patterns are located, and the thermal diffusion conductor pattern does not define a closed loop around the hole through which the magnetic core extends.
2. A coil-integrated switching power supply module comprising: a multilayer substrate in which spiral coil conductor patterns are provided on multiple layers, holes are located at an inner side and an outer side of each of the coil conductor patterns, and circuit element mounting electrodes are located on outer surfaces of the multilayer substrate; a magnetic core that extends through the holes located at the inner side and the outer side of each of the coil conductor patterns of the multilayer substrate to define a closed magnetic circuit; and circuit elements mounted on the circuit element mounting electrodes; wherein at least one of the coil conductor pattern includes one turn and is an expansion coil conductor pattern that continuously extends outside areas where the coil conductor patterns are located.
3. The coil-integrated switching power supply module according to claim 1 , wherein a thermal coupling member for heat radiation to an external heat radiation member is provided on at least one outer surface of the multilayer substrate and conductor through holes are provided between the thermal diffusion conductor pattern and the thermal coupling member.
4. The coil-integrated switching power supply module according to claim 2 , wherein a thermal coupling member for heat radiation to an external heat radiation member is provided on at least one outer surface of the multilayer substrate and conductor through holes are provided between the expansion coil conductor pattern and the thermal coupling member.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 18, 2012
December 18, 2012
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