A porcelain enamel substrate (1) mounts a light emitting element in which a porcelain enamel layer (5) is coated onto a surface of a core metal (4), and a reflective cup portion (7) that has a flat bottom surface and a sloping portion that surrounds this bottom surface is provided on a light emitting element mounting surface, and an electrode (6) for energizing a light emitting element (3) is provided on the light emitting element mounting surface, and the thickness of the electrode (6) within the reflective cup portion (7) is within a range of 5 μm to 100 μm.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A porcelain enamel substrate for mounting a light emitting element comprising: a core metal; a reflective cup portion that is provided on a light emitting element mounting surface, and has a flat bottom surface and a sloping portion that surrounds the flat bottom surface; a porcelain enamel layer that is directly coated onto both a surface of the core metal and a surface of the reflective cup portion; and an electrode for energizing the light emitting element that is provided on the light emitting element mounting surface; wherein the thickness of the electrode within the reflective cup portion is within a range of 5 μm to 100 μm; wherein the electrode is formed by printing a conductive paste onto the porcelain enamel layer using pad printing and then baking the conductive paste.
2. The porcelain enamel substrate according to claim 1 , wherein the thickness of the electrode within the reflective cup portion is within a range of 5 μm to 50μm.
3. A light emitting element module comprising: the porcelain enamel substrate for mounting the light emitting element according to claim 1 ; and a light emitting element that is mounted on the porcelain enamel substrate.
4. The light emitting element according to claim 3 being energized by the electrode.
5. An illumination device comprising the light emitting element module according to claim 3 .
6. A display unit comprising the light emitting element module according to claim 3 .
7. A traffic signal comprising the light emitting element module according to claim 3 .
8. The porcelain enamel substrate according to claim 1 , further comprising a conductive wire interconnecting the light emitting element and the electrode.
9. The porcelain enamel substrate according to claim 1 , wherein both the core metal and the reflective cup portion are formed of a single material.
10. A method of manufacturing a porcelain enamel substrate comprising: preparing a core metal obtained by forming a reflective cup portion, the reflective cup portion having a flat bottom surface and a sloping portion, the sloping portion surrounding the bottom surface in a metal material; forming a porcelain enamel layer by baking a porcelain enamel material directly onto both a surface of the core metal and a surface of the reflective cup portion; and forming an electrode on a light emitting element mounting surface on which the reflective cup portion is provided; wherein the thickness of the electrode within the reflective cup portion is within a range of 5μm to 100 μm; wherein the electrode is formed by printing a conductive paste onto the porcelain enamel layer using a pad printing method and then baking the conductive paste.
11. The method according to claim 10 wherein the thickness of the electrode within the reflective cup portion is within a range of 5 μm to 50 μm.
12. A porcelain enamel substrate for mounting a light emitting element comprising: a core metal; a porcelain enamel layer that is coated directly onto a surface of the core metal; a reflective cup portion that is provided on a light emitting element mounting surface, and has a flat bottom surface and a sloping portion that surrounds the flat bottom surface; and an electrode for energizing the light emitting element which is provided on the porcelain enamel layer and on which the light emitting element is mounted; wherein the thickness of the electrode within the reflective cup portion is within a range of 5 μm to 100 μm; wherein the electrode is formed by printing a conductive paste onto the porcelain enamel layer using pad printing and then baking the conductive paste.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 17, 2009
February 26, 2013
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