Provided is a method of manufacturing a semiconductor device. The method includes: loading a substrate into a process vessel; performing a process to form an film on the substrate by alternately repeating: (a) forming a layer containing an element on the substrate by supplying at least two types of source gases into the process vessel, each of the at least two types of source gases containing the element, and (b) changing the layer containing the element by supplying reaction gas into the process vessel, the reaction gas being different from the at least two types of source gases; and unloading the processed substrate from the process vessel.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a semiconductor device, the method comprising: loading a substrate into a process vessel; performing a process to form a film on the substrate by alternately repeating: (a) forming a layer containing an element on the substrate by supplying at least two types of source gases into the process vessel, each of the at least two types of source gases containing the element; and (b) changing the layer containing the element into the film by supplying a reaction gas into the process vessel, the reaction gas being different from the at least two types of source gases; and unloading the processed substrate from the process vessel.
2. The method of claim 1 , wherein the at least two types of source gases have different reactivity, respectively.
3. The method of claim 1 , wherein an amount of the most reactive source gas of the at least two types of source gases is set to be lower than that of any other of the at least two types of source gases.
4. The method of claim 1 , wherein a flow rate of the most reactive source gas of the at least two types of source gases is set to be lower than that of any other of the at least two types of source gases.
5. The method of claim 1 , wherein a supply time of the most reactive source gas of the at least two types of source gases is set to be shorter than that of any other of the at least two types of source gases.
6. The method of claim 1 , wherein a supply of the most reactive source gas of the at least two types of source gases is stopped before that of any other of the at least two types of source gases is stopped.
7. The method of claim 1 , wherein a supply of the at least two types of source gases are simultaneously started, and a supply of the most reactive source gas of the at least two types of source gases is stopped before that of any other of the at least two types of source gases is stopped.
8. The method of claim 1 , wherein a supply of the most reactive source gas of the at least two types of source gases is started before that of any other of the at least two types of source gases is started.
9. The method of claim 1 , wherein a supply of the most reactive source gas of the at least two types of source gases is started before that of any other of the at least two types of source gases is started, and the supply of the most reactive source gas of the at least two types of source gases is stopped before that of any other of the at least two types of source gases is stopped.
10. The method of claim 1 , wherein after a supply of the most reactive source gas of the at least two types of source gases is stopped, a supply of any other of the at least two types of source gases is started.
11. The method of claim 1 , wherein after the most reactive source gas of the at least two types of source gases is supplied into the process vessel, any other of the at least two types of source gases is supplied into the process vessel.
12. The method of claim 1 , wherein the film includes one of an oxide film, a nitride film and an oxynitride film.
13. The method of claim 1 , wherein the element includes one of a semiconductor element and a metal element.
14. The method of claim 1 , wherein the element includes one of Si, Ti, Zr, Hf, and Al.
15. The method of claim 1 , wherein the film includes one of a silicon oxide film, a silicon nitride film, a silicon oxynitride film, a metal oxide film, a metal nitride film and a metal oxynitride film.
16. A method of manufacturing a semiconductor device, the method comprising: loading a substrate into a process vessel; performing a process to form a film on the substrate by alternately repeating: (a) supplying at least two types of source gases into the process vessel, each of the at least two types of source gases containing an element; and (b) supplying a reaction gas into the process vessel, the reaction gas being different from the at least two types of source gases; and unloading the processed substrate from the process vessel.
17. A substrate processing apparatus comprising: a process vessel configured to accommodate a substrate; a source gas supply system configured to supply at least two types of source gases into the process vessel, each of the at least two types of source gases containing an element; a reaction gas supply system configured to supply a reaction gas into the process vessel, the reaction gas being different from the at least two types of source gases; and a control unit configured to control the source gas supply system and the reaction gas supply system, so as to form a film on the substrate by alternately repeating: (a) forming a layer containing the element on the substrate by supplying the at least two types of source gases into the process vessel; and (b) changing the layer containing the element into the film by supplying the reaction gas into the process vessel.
18. A method of manufacturing a semiconductor device, the method comprising: loading a substrate into a process vessel; performing a process to form a film on the substrate by repeating: (a) supplying one of at least two types of source gases into the process vessel, each of the at least two types of source gases containing an element; (b) supplying any of the at least two types of source gases other than the one supplied in the step (a) into the process vessel; and (c) supplying a reaction gas into the process vessel, the reaction gas being different from the at least two types of source gases; and unloading the processed substrate from the process vessel.
19. The method of claim 18 , wherein the step (a), the step (b) and the step (c) are performed in order.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 1, 2011
April 9, 2013
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