Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A composition, comprising: a low melting point solder; a thermal-curable mixture, wherein the thermal-curable mixture includes a thermal-curable polymer resin, a curing agent of an anhydride family material, and a CNT-Cu (Carbon Nano Tube-Copper), wherein the composition is anisotropic conductive, wherein a volume percent of the low melting point solder is in the range of about 1% to about 60% with respect to the thermal-curable mixture, and a volume percent of the CNT-Cu with respect to the thermal-curable mixture is in the range of about 0.1% to about 50%, and wherein a curing temperature of the thermal-curable polymer resin is higher than a melting point of the low melting point solder.
2. The composition of claim 1 , wherein the thermal-curable polymer resin comprises a hydroxyl group and the low melting point solder serves as a curing catalyst.
3. The composition of claim 1 , further comprising a deforming agent which reduces a surface tension of the thermal-curable polymer resin, wherein the deforming agent comprises polyglycols, glycerides, polyprophylene glycol, dimethylsilicone, simethicone, tributhyl phosphate, or polydimethylsiloxane.
4. The composition of claim 1 , wherein the curing agent is maleic anhydride.
5. The composition of claim 1 , wherein an equivalent ratio of the curing agent to thermal-curable polymer resin is about 0.3.
6. The composition of claim 1 , wherein the thermal-curable polymer resin and the curing agent collectively form a thermal-curable mixture; and the low melting point solder has about 40 volume % with respect to the thermal-curable mixture.
7. The composition of claim 1 , wherein the composition uses a carboxyl group material generated through a reaction between the anhydride family material and the polymer resin as a reductant for removing an oxide on the low melting point solder, without using an additional reductant.
8. The composition of claim 1 , further comprising a deforming agent which reduces a surface tension of the thermal-curable polymer resin, wherein the deforming agent comprises acrylate oligomer, polyglycols, glycerides, polyprophylene glycol, dimethylsilicone, simethicone, tributhyl phosphate, or polydimethylsiloxane.
9. The composition of claim 8 , wherein the thermal-curable polymer resin, the curing agent and the deforming agent collectively form a thermal-curable mixture; and the low melting point solder has about 40 volume % with respect to the thermal-curable mixture.
10. A composition, comprising: a low melting point solder; a thermal-curable mixture; and a deforming agent which reduces a surface tension of the thermal-curable polymer resin, wherein the thermal-curable mixture includes a thermal-curable polymer resin, a curing agent of an amine family material, and a CNT-Cu (Carbon Nano Tube-Copper), wherein the composition is anisotropic conductive, wherein a volume percent of the low melting point solder is in the range of about 1% to about 60% with respect to the thermal-curable mixture, and a volume percent of the CNT-Cu with respect to the thermal-curable mixture is in the range of about 0.1% to about 50%.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 2, 2009
April 16, 2013
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