A monolithic microwave integrated circuit (MMIC) includes a transistor, coupled line and multiple air bridges. The coupled line is configured to output a coupled signal from the transistor, the coupled line running parallel to a drain of the transistor. The air bridges connect the drain of the transistor with a bond pad for outputting a transistor output signal, the bridges being arranged parallel to one another and extending over the coupled line. The air bridges and the coupled line effectively provide coupling of the transistor output signal to a load.
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1. A monolithic microwave integrated circuit (MMIC), comprising: a transistor; a coupled line configured to output a coupled signal from the transistor, the coupled line running parallel to a drain of the transistor; and a plurality of air bridges electrically connecting the drain of the transistor with a bond pad for outputting a transistor output signal to a load, the plurality of air bridges being arranged parallel to one another and extending over the coupled line for providing the coupled signal to the coupled line by coupling the transistor output signal.
A monolithic microwave integrated circuit (MMIC) contains a transistor, a coupled line, and multiple air bridges. The coupled line extracts a signal from the transistor and runs parallel to the transistor's drain. The air bridges connect the transistor's drain to a bond pad (for outputting a signal to a load). These air bridges are parallel to each other and extend over the coupled line. This arrangement couples the transistor's output signal to the coupled line.
2. The MMIC of claim 1 , wherein the plurality of air bridges and the coupled line form a distributed capacitor running a length of the drain of the transistor.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, forms a distributed capacitor. This capacitor extends along the length of the transistor's drain.
3. The MMIC of claim 1 , wherein the coupling occurs at a first level metallization in the MMIC.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, performs the signal coupling between the transistor output and coupled line using the first metal layer within the MMIC manufacturing process.
4. The MMIC of claim 1 , wherein increasing the number of air bridges of the plurality of air bridges increases a coupling coefficient of the coupling.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, has a coupling strength that can be adjusted by changing the number of air bridges. More air bridges lead to stronger coupling.
5. The MMIC of claim 1 , wherein increasing a width of the coupled line increases a coupling coefficient of the coupling.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, has a coupling strength that can be adjusted by changing the width of the coupled line. A wider coupled line leads to stronger coupling.
6. The MMIC of claim 1 , wherein decreasing a distance between the coupled line and one of metallization of the drain or metallization of the bond pad increases a coupling coefficient of the coupling.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, has a coupling strength that can be adjusted by changing the distance between the coupled line and either the metallization on the drain or the metallization on the bond pad. Decreasing the distance increases coupling.
7. The MMIC of claim 1 , wherein decreasing a distance between the coupled line and the plurality of air bridges increases a coupling coefficient of the coupling.
The MMIC, as described above, where a transistor's drain is connected to a bond pad via air bridges above a parallel coupled line, has a coupling strength that can be adjusted by changing the distance between the coupled line and the air bridges. Decreasing the distance increases coupling.
8. A monolithic microwave integrated circuit (MMIC), comprising: a multi-stage amplifier comprising a final stage and at least one previous stage; a first coupled line at the final stage of the multi-stage amplifier configured to provide a first coupled signal; and a plurality of first air bridges electrically connecting an output of the final stage to a bond pad for outputting a radio frequency (RF) signal from the of the multi-stage amplifier to a load, the plurality of first air bridges extending over the first coupled line for providing the first coupled signal to the first coupled line from the RF signal output from the multi-stage amplifier to.
A monolithic microwave integrated circuit (MMIC) includes a multi-stage amplifier (with a final stage and at least one previous stage), a coupled line at the final stage, and multiple air bridges. The coupled line extracts a signal. The air bridges connect the output of the final stage to a bond pad (for outputting the RF signal from the amplifier to a load). The air bridges extend over the coupled line, allowing it to extract a signal from the amplifier's RF output.
9. The MMIC of claim 8 , wherein the first coupled line is connected to an output detector configured to determine a power level of the RF signal output by the multi-stage amplifier.
The MMIC with multi-stage amplifier using a final-stage coupled line and air bridges, as described above, where the coupled line is connected to an output detector. This detector measures the power level of the RF signal output by the multi-stage amplifier.
10. The MMIC of claim 8 , wherein the first coupled line is connected to a feedback network leading to a signal processing circuit comprising the at least one previous stage for providing a feedback signal to the at least one previous stage.
The MMIC with multi-stage amplifier using a final-stage coupled line and air bridges, as described above, where the coupled line is connected to a feedback network that routes back to a signal processing circuit in one of the previous amplifier stages. This provides a feedback signal to that earlier stage.
11. The MMIC of claim 8 , wherein the first coupled line is connected to an input of another amplifier for driving the other amplifier.
The MMIC with multi-stage amplifier using a final-stage coupled line and air bridges, as described above, where the coupled line is connected to the input of another amplifier. This coupled signal then drives that other amplifier.
12. The MMIC of claim 8 , further comprising: a second coupled line at the final stage of the multi-stage amplifier configured to provide a second coupled signal, wherein the second coupled line runs parallel to the first coupled line and the plurality of first air bridges also extends over the second coupled lines for providing the second coupled signal to the second coupled line.
The MMIC with multi-stage amplifier using a final-stage coupled line and air bridges, as described above, includes a second coupled line at the final stage, running parallel to the first. The air bridges also extend over this second coupled line, allowing it to also extract a signal from the amplifier's RF output.
13. The MMIC of claim 12 , wherein the first coupled line is connected to an output detector configured to determine a power level of the RF signal output by the multi-stage amplifier based on the first coupled signal, and wherein the second coupled line is connected to a feedback network leading to a signal processing circuit comprising the at least one previous stage for providing a feedback signal to the at least one previous stage based on the second coupled signal.
The MMIC with multi-stage amplifier using final-stage coupled lines and air bridges, as described above, uses the first coupled line connected to a detector which measures the output power. A second coupled line is connected to a feedback network providing a feedback signal to a previous stage.
14. The MMIC of claim 8 , further comprising: a second coupled line at the at least one previous stage of the multi-stage amplifier configured to provide a second coupled signal; and a plurality of second air bridges connecting an output of the at least one previous stage to an input of the final stage of the multi-stage amplifier, the plurality of second air bridges extending over the second coupled line.
The MMIC includes a multi-stage amplifier, a first coupled line at the final stage connected via air bridges, and a *second* coupled line located at one of the *previous* amplifier stages. Multiple air bridges connect the output of this earlier stage to the input of the final stage, with the air bridges extending over the second coupled line.
15. The MMIC of claim 14 , wherein the second coupled line is connected to an output detector configured to determine a power level of a signal output by the at least one previous stage of the multi-stage amplifier.
The MMIC with multi-stage amplifier using previous and final stage coupled lines and air bridges, as described above, uses the second coupled line, at the previous stage, connected to an output detector. This detector measures the power level of the signal output by that previous amplifier stage.
16. A coupling device, included in a monolithic microwave integrated circuit (MMIC), for coupling a power amplifier with a load, the coupling device comprising: a coupled line configured to provide a coupled signal from a transistor included in the power amplifier; and a plurality of air bridges connecting one of a drain or a collector of the transistor with a bond pad for outputting a radio frequency (RF) signal from the power amplifier to a load, the plurality of air bridges extending over the coupled line for providing the coupled signal to the coupled line.
A coupling device within a monolithic microwave integrated circuit (MMIC) is used to couple a power amplifier to a load. It includes a coupled line that extracts a signal from a transistor inside the amplifier, and multiple air bridges that connect the transistor's drain or collector to a bond pad (for outputting the amplifier's RF signal to a load). The air bridges extend over the coupled line, enabling signal extraction.
17. The coupling device of claim 16 , wherein the coupled line comprises a plurality of coupled ports, at least one coupled port being connected to an output detector.
The coupling device that connects a power amplifier to a load using a coupled line and air bridges, as described above, includes multiple ports on the coupled line. At least one of these ports is connected to an output detector circuit.
18. The coupling device of claim 17 , wherein the output detector is configured to sample power output by the transistor across an entire length of the drain or collector via the coupled line, and to convert the sampled output power to a DC signal.
The coupling device that connects a power amplifier to a load using a coupled line and air bridges, as described above, where the output detector samples the power output by the transistor along the *entire length* of its drain or collector using the coupled line. It then converts this sampled power into a DC signal.
19. The coupling device of claim 16 , wherein a coupling coefficient is controllable by adjusting a number of air bridges in the plurality of air bridges.
The coupling device that connects a power amplifier to a load using a coupled line and air bridges, as described above, has a coupling coefficient which can be controlled by adjusting the *number* of air bridges.
20. The coupling device of claim 16 , wherein a coupling coefficient is controllable by adjusting a distance of the coupled line from at least one of the plurality of air bridges, the drain or collector of the transistor, and the bond pad.
The coupling device that connects a power amplifier to a load using a coupled line and air bridges, as described above, has a coupling coefficient which can be controlled by adjusting the *distance* of the coupled line from the air bridges, the transistor's drain or collector, or the bond pad.
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August 18, 2011
June 11, 2013
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