A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, wherein the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a first insulating portion and a second insulating portion, the first insulating portion comprises a first upward surface, a first downward surface, a first thickness and a recess formed on the first downward surface, wherein the recess comprises a bottom surface. The second insulating portion comprises a second upward surface, a second downward surface and a second thickness larger than the first thickness. The trace layer is at least formed on the second insulating portion, the chip disposed on top of the substrate is electrically connected with the trace layer and comprises a plurality of bumps, and the heat dissipation paste is disposed at the recess.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A thin flip chip package structure comprises: a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess.
A thin flip chip package structure includes a substrate, a chip, and heat dissipation paste. The substrate contains an insulating layer and a trace layer. The insulating layer has two parts: a first insulating portion with a recess on its underside, and a second insulating portion made of the same piece as the first, but thicker. The top surfaces of both insulating portions are level with each other. The trace layer is formed on the second insulating portion. The chip sits on top of the substrate and connects to the trace layer using bumps. The heat dissipation paste is located within the recess.
2. The thin flip chip package structure in accordance with claim 1 , wherein the heat dissipation paste is in contact with the bottom surface of the recess.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, has the heat dissipation paste touching the bottom surface of the recess.
3. The thin flip chip package structure in accordance with claim 2 , wherein the heat dissipation paste is in contact with the first downward surface of the first insulating portion.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, where the heat dissipation paste is in contact with the bottom surface of the recess, also has the heat dissipation paste touching the underside of the first insulating portion.
4. The thin flip chip package structure in accordance with claim 1 further comprises a sealing resin formed on the second upward surface of the second insulating portion, and the bumps of the chip are covered by the sealing resin.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, also includes a sealing resin covering the chip's bumps and formed on the upper surface of the thicker, second insulating portion.
5. The thin flip chip package structure in accordance with claim 1 , wherein the heat dissipation paste comprises a plurality of heat conducting particles, the heat conducting particles can be chosen from tin, silver, copper, indium, lead, antimony, gold, bismuth, aluminum, alumina, aluminum nitride, boron nitride, titanium boride, titanium diboride, silicon carbide and graphite.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, utilizes heat dissipation paste which contains heat-conducting particles. These particles can be made from tin, silver, copper, indium, lead, antimony, gold, bismuth, aluminum, alumina, aluminum nitride, boron nitride, titanium boride, titanium diboride, silicon carbide, or graphite.
6. The thin flip chip package structure in accordance with claim 1 further comprises a heat dissipation plate in contact with the heat dissipation paste.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar, and the trace layer is formed on the second insulating portion; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, also features a heat dissipation plate in contact with the heat dissipation paste, further improving heat removal.
7. The thin flip chip package structure in accordance with claim 1 , wherein the trace layer is formed on the first insulation portion.
The thin flip chip package structure, as described with a substrate having an insulating layer and a trace layer, the insulating layer comprising a first insulating portion and a second insulating portion formed as one-piece with the first insulating portion, the first insulating portion comprising a first upward surface, a first downward surface, a first thickness and a recess formed at the first downward surface, wherein the recess having a bottom surface, the second insulating portion comprising a second upward surface, a second downward surface and a second thickness larger than the first thickness, wherein the second upward surface and the first upward surface are coplanar; a chip disposed on top of the substrate, the chip comprising a plurality of bumps and electrically connecting with the trace layer; and a heat dissipation paste disposed at the recess, has the trace layer formed on the *first* insulation portion, in addition to, or instead of, the second insulating portion.
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June 20, 2011
June 25, 2013
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