A wireless IC device includes a wireless IC chip arranged to process a transmission/received signal, a matching inductance element and a planar electrode which are provided on the surface of a feeder circuit board formed by a flexible dielectric, and a loop-shaped radiation plate provided on the undersurface of the feeder circuit board. Both ends of the radiation plate are coupled to a resonance circuit including an inductance element by electromagnetic field coupling. The wireless IC chip is operated using a signal received by the radiation plate. A response signal transmitted from the wireless IC chip is externally transmitted from the radiation plate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A wireless IC device comprising: a wireless IC chip arranged to process a transmission/received signal, and including a first terminal and a second terminal; a first inductance element connected between the first terminal and the second terminal; a second inductance element having a loop shape; wherein a first end of the second inductance element is capacitively coupled to the first inductance element, and a second end of the second inductance element is electrically connected to one end of the first inductance element; the first inductance element is arranged to match impedance between the wireless IC chip and the second inductance element; and the second inductance element defines a radiator.
2. The wireless IC device according to claim 1 , wherein the first and second ends of the second inductance element are adjacent to each other.
3. The wireless IC device according to claim 1 , wherein the second inductance element is a strip radiation plate.
4. The wireless IC device according to claim 1 , further comprising a first planar electrode that faces the first inductance element and is electrically connected to the second inductance element.
5. The wireless IC device according to claim 4 , wherein the first end of the second inductance element defines the first planar electrode.
6. The wireless IC device according to claim 4 , wherein the first planar electrode is disposed between the first inductance element and the first end of the second inductance element and is electrically connected to the second inductance element via a connection portion.
7. The wireless IC device according to claim 4 , wherein an area of the first planar electrode is larger than an area required for the first inductance element.
8. The wireless IC device according to claim 4 , further comprising a second planar electrode disposed between the wireless IC chip and the second inductance element.
9. The wireless IC device according to claim 1 , wherein the first end of the second inductance element faces the first inductance element and the second end of the second inductance element faces the second planar electrode.
10. The wireless IC device according to claim 8 , wherein, as viewed from one main surface of the wireless IC chip, the first inductance element and the second planar electrode are disposed at different positions.
11. The wireless IC device according to claim 1 , wherein a resonance frequency of the second inductance element is higher than a resonance frequency of the first inductance element and a usable frequency of the wireless IC device.
12. The wireless IC device according to claim 1 , wherein a usable frequency of the wireless IC device substantially corresponds to a resonance frequency of the first inductance element.
13. The wireless IC device according to claim 1 , further comprising a feeder circuit board defined by a multilayer substrate including the first inductance element and the second inductance element.
14. The wireless IC device according to claim 1 , further comprising a feeder circuit board defined by a flexible substrate including the first inductance element and the second inductance element.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 28, 2009
July 2, 2013
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