An integrated circuit arrangement on a common chip or chip support, for safety critical applications, in particular for use in control and regulation units for a motor vehicle braking system, including at least one microprocessor system module, which has at least one core processor, provided with at least one ROM and at least one RAM, at least one power module for controlling external users and at least one monitoring module for monitoring at least parts and/or part systems of the circuit arrangement, the circuit arrangement including at least one temperature sensor for recording a chip temperature.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An integrated circuit arrangement, arranged on a shared chip or chip carrier, for safety-critical applications as a control and regulation unit in a motor vehicle braking system, comprising: at least one microprocessor system module which has at least one processor core with which at least one read-only memory and at least one read/write memory are associated, the at least one microprocessor system module powered by a main power supply, at least one power module for actuating external loads, the at least one power module powered by the main power supply, and at least one monitoring module for monitoring at least one of the microprocessor and memory of the circuit arrangement, the at least one monitoring module powered by a secondary power supply independent from the main power supply, wherein the integrated circuit arrangement has at least one temperature sensor for sensing a chip temperature.
A safety-critical integrated circuit for motor vehicle braking systems on a single chip includes a microprocessor system with a processor core, read-only memory (ROM), and read/write memory (RAM), powered by a main power supply. A power module, also powered by the main supply, actuates external loads. A monitoring module oversees the microprocessor and memory, powered by an independent, secondary power supply. The circuit incorporates a temperature sensor to measure chip temperature.
2. The circuit arrangement as claimed in claim 1 , wherein the microprocessor system module has two redundant processor cores with which both at least one read-only memory and at least one read/write memory are respectively or jointly associated.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. The microprocessor system module features two redundant processor cores, each with dedicated or shared ROM and RAM.
3. The circuit arrangement as claimed in claim 1 , wherein the at least one temperature sensor has at least one associated temperature monitoring unit which can use an evaluation circuit, an evaluation program, or both an evaluation circuit and an evaluation program to evaluate temperature data for the at least one temperature sensor and can shut down subsystems of the circuit arrangement and/or put them into an emergency operating mode with restricted functionality.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. This circuit includes a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data. It can shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached.
4. The circuit arrangement as claimed in at least claim 3 , wherein the temperature monitoring unit has a sensor self-test circuit which tests one or more temperature sensors and the evaluation circuit and/or the evaluation program for correct operation.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. Also featuring a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data and shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached. The temperature monitoring unit incorporates a self-test circuit to verify the proper operation of the temperature sensor(s), evaluation circuit, and/or evaluation program.
5. The circuit arrangement as claimed in at least claim 1 , wherein at least one temperature sensor is arranged on the chip in a region between two or more modules.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. At least one temperature sensor is positioned on the chip between two or more modules.
6. The circuit arrangement as claimed in claim 5 , wherein at least one temperature sensor is respectively arranged between the microprocessor system module and the power module, and at least one other temperature sensor is respectively arranged between the microprocessor system module and the at least one monitoring module.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. One temperature sensor is located between the microprocessor system module and the power module, while another is positioned between the microprocessor system module and the monitoring module.
7. The circuit arrangement as claimed in claim 3 , wherein the temperature monitoring unit is configured such that upon establishing that a defined temperature threshold for at least one subsystem and/or subregion of the chip has been reached and/or exceeded it can perform and/or prompt at least one of the following measures using a program: create or store an error report, shut down subsystems of the circuit arrangement or put subsystems of the circuit arrangement into an emergency operating mode with restricted functionality, shut down at least one external system, and shut down at least one defined interface unit of the circuit arrangement.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. Also featuring a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data and shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached. When a defined temperature threshold is reached or exceeded for a subsystem or subregion, the temperature monitoring unit can create/store an error report, shut down subsystems, place subsystems in emergency mode, shut down external systems, or shut down defined interface units, using a program.
8. The circuit arrangement as claimed in claim 7 , wherein the temperature monitoring unit is configured to shut down subsystems of the circuit arrangement or put subsystems of the circuit arrangement into an emergency operating mode with restricted functionality on the basis of a defined period for which a defined temperature threshold and/or temperature threshold function is exceeded.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. Also featuring a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data and shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached. When a defined temperature threshold is reached or exceeded for a subsystem or subregion, the temperature monitoring unit can create/store an error report, shut down subsystems, place subsystems in emergency mode, shut down external systems, or shut down defined interface units, using a program. The temperature monitoring unit can shut down subsystems or enter emergency mode based on how long a defined temperature threshold is exceeded.
9. The circuit arrangement as claimed in claim 1 further comprising two redundant monitoring modules which are arranged on opposite edge regions of the chip and/or at a distance from one another.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. This circuit also comprises two redundant monitoring modules positioned on opposite edges of the chip or at a distance from each other.
10. The circuit arrangement as claimed in claim 3 , wherein the temperature monitoring unit is part of the monitoring module.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. Also featuring a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data and shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached. The temperature monitoring unit is integrated as part of the monitoring module.
11. The circuit arrangement as claimed in claim 1 , wherein the at least one monitoring module has an independent power supply device.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. The monitoring module has its own, independent power supply.
12. The circuit arrangement as claimed in claim 1 , wherein the at least one monitoring module is arranged on the chip such that a power supply of the power module, is not adjacent to the at least one monitoring module.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. The monitoring module is positioned on the chip so that the power module's power supply is not directly adjacent to it.
13. The circuit arrangement as claimed in claim 1 , wherein the at least one monitoring module and the at least one power module are arranged on edge regions of the chip which are essentially opposite one another.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. The monitoring module and the power module are positioned on opposite edges of the chip.
14. The circuit arrangement as claimed in claim 1 , wherein the microprocessor system module of the circuit arrangement contains no power circuits.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. The microprocessor system module does not contain any power circuits.
15. The circuit arrangement as claimed in claim 3 , wherein the circuit arrangement is connected to an external power supply shutdown device by at least one emergency shutdown path, and the temperature monitoring unit and/or at least one monitoring module can use at least one emergency shutdown path to prompt an interruption in a power supply for at least portions of the integrated circuit arrangement by the external power supply shutdown device.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature. Also featuring a temperature monitoring unit that utilizes an evaluation circuit, an evaluation program, or both, to analyze temperature sensor data and shut down subsystems or put them into an emergency mode with limited functionality if critical temperatures are reached. The circuit is connected to an external power supply shutdown device via an emergency shutdown path. The temperature monitoring unit and/or the monitoring module can use this path to trigger the external device to interrupt power to portions of the integrated circuit.
16. The use of at least one integrated circuit arrangement as claimed in claim 1 in a motor vehicle regulation system.
The integrated circuit for motor vehicle braking systems, as described with a microprocessor system with a processor core, read-only memory (ROM), read/write memory (RAM), a main power supply, a power module actuating external loads, a monitoring module powered by an independent secondary power supply, and a temperature sensor to measure chip temperature, is used in a motor vehicle regulation system.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 23, 2008
July 23, 2013
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