A mounting substrate includes: a mounting area on which an electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member which is formed on a boundary between the mounting area and the electrode forming area so as to block flow out of a filling material being filled between the electronic element and the mounting substrate, into the electrode forming area, wherein recess portions that face the electrodes are formed on an outer peripheral surface of the dam member and a part of the electrodes are formed within the recess portions.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A mounting substrate comprising: a mounting area on which an electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member which is formed on a boundary between the mounting area and the electrode forming area so as to block a filling material, which is being filled between the electronic element and the mounting substrate, from flowing out into the electrode forming area, wherein an outer peripheral surface of the dam member defines recess portions, each of said recess portions facing toward an associated one of the electrodes, and a clearance between the recess portion and the associated electrode facing the recess portion is set equal respectively within an area where the recess portion and the associated electrode face each other.
A mounting substrate for electronic components has a central mounting area where a chip is placed and an electrode area surrounding it, where electrical connections are made. A dam, acting like a barrier, is formed at the boundary between the mounting and electrode areas. This dam prevents the filling material, such as an underfill adhesive, from leaking into the electrode area after it's dispensed between the chip and the substrate. The dam's outer surface has recessed sections (notches) facing each electrode, maintaining a consistent gap between each recess and its corresponding electrode across their facing surfaces.
2. The mounting substrate according to claim 1 , wherein a first width dimension of the dam member in a position other than a position where one of the recess portions is formed is larger than a second width dimension of the dam member in the position where one of the recess portions is formed.
The mounting substrate, as described with a mounting area, electrode area, a dam, and recesses in the dam, has a dam that varies in width. The dam is wider in areas *without* a recess than it is at the location of each recess. So the dam is thicker in most places but thins down at the recess locations near the electrodes.
3. The mounting substrate according to claim 1 , wherein a solder resist is formed on a substrate body of the mounting substrate and the dam member is formed of the same material as the solder resist.
The mounting substrate, as described with a mounting area, electrode area, a dam, and recesses in the dam, is constructed with a solder resist layer on the main body of the substrate. The dam is made from the *same* material as this solder resist. This simplifies manufacturing since both features can be created in the same process step.
4. The mounting substrate according to claim 1 , wherein an inner peripheral surface of the dam member that faces the mounting area is formed into a linear shape.
The mounting substrate, as described with a mounting area, electrode area, a dam, and recesses in the dam, has a dam whose *inner* edge, which faces the central mounting area (where the chip sits), has a straight, linear shape. This provides a clean, well-defined boundary for the mounting area and the filling material.
5. The mounting substrate according to claim 1 , wherein the filling material is an underfill resin.
The mounting substrate, as described with a mounting area, electrode area, a dam, and recesses in the dam, uses an underfill resin as the "filling material" that is blocked by the dam. This underfill material is dispensed to fill the space between the electronic component and the mounting substrate, enhancing mechanical strength and thermal dissipation.
6. An electronic device comprising: an electronic element; a mounting substrate; and a filling material being filled between the electronic element and the mounting substrate, wherein the mounting substrate includes: a mounting area on which the electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member that is formed on a boundary between the mounting area and the electrode forming area so as to block flow out of the filling material into the electrode forming area, wherein an outer peripheral surface of the dam member defines recess portions, each of said recess portions facing toward an associated one of the electrodes, and a clearance between the recess portion and the associated electrode facing the recess portion is set equal respectively within an area where the recess portion and the associated electrode face each other.
An electronic device consists of an electronic component mounted on a substrate, with a filling material in between. The substrate has a central mounting area for the component, an electrode area around it for electrical connections, and a dam separating them. The dam prevents the filling material from leaking into the electrode area. The dam's outer surface has recessed sections (notches) facing each electrode. The clearance, or gap, between each recess and the electrode it faces, is consistent within the area they face each other.
7. The electronic device according to claim 6 , wherein a first width dimension of the dam member in a position other than a position where one of the recess portions is formed is larger than a second width dimension of the dam member in the position where one of the recess portions is formed.
The electronic device, as described with an electronic component, mounting substrate, filling material, a mounting area, electrode area, a dam, and recesses in the dam, has a dam that varies in width. The dam is wider in areas *without* a recess than it is at the location of each recess. The dam has different thicknesses depending on where the recesses are positioned.
8. The electronic device according to claim 6 , wherein a solder resist is formed on a substrate body of the mounting substrate, the dam member is formed of the same material as the solder resist, and the solder resist and the dam member are integrally formed as a unitary piece.
The electronic device, as described with an electronic component, mounting substrate, filling material, a mounting area, electrode area, a dam, and recesses in the dam, is built with a solder resist layer. The dam is formed of the *same* material as the solder resist. Further, the solder resist and the dam are made as one single, integrated piece (unitary).
9. The electronic device according to claim 6 , wherein the outer peripheral surface of the dam member defines the recess portions as curved surfaces which are concave relative to the electrode forming area.
The electronic device, as described with an electronic component, mounting substrate, filling material, a mounting area, electrode area, a dam, and recesses in the dam, includes recesses in the dam's outer surface that are curved, specifically concave, relative to the surrounding electrode area. Think of them as inward-facing curves.
10. The electronic device according to claim 9 , wherein inner peripheral surfaces of the dam member that face the mounting area and are disposed at positions opposite to the recess portions are formed into a linear shape.
The electronic device, as described with an electronic component, mounting substrate, filling material, a mounting area, electrode area, a dam with curved recesses, has a dam whose inner edge, that faces the central mounting area and is located *opposite* the curved recesses, is formed into a straight, linear shape.
11. The mounting substrate according to claim 3 , wherein the solder resist and the dam member are integrally formed as a unitary piece.
The mounting substrate with solder resist, where the dam is formed from the same material as the solder resist, features a solder resist and the dam integrally formed as a single piece (unitary). This simplifies manufacturing and ensures a robust seal.
12. The mounting substrate according to claim 1 , wherein the outer peripheral surface of the dam member defines the recess portions as curved surfaces which are concave relative to the electrode forming area.
The mounting substrate, as described with a mounting area, electrode area, a dam, and recesses in the dam, has recesses in the dam's outer surface are curved, specifically concave, relative to the surrounding electrode area. They are inward-facing curves formed on the dam.
13. The mounting substrate according to claim 12 , wherein inner peripheral surfaces of the dam member that face the mounting area and are disposed at positions opposite to the recess portions are formed into a linear shape.
The mounting substrate with curved recesses in the dam, has a dam whose inner edge, that faces the central mounting area and is located *opposite* the curved recesses, is formed into a straight, linear shape.
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December 21, 2007
August 6, 2013
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