A packaging layer (200) for a wafer level assembly is fabricated from a glass material comprising both inorganic and organic components. This allows matching between the coefficient of thermal expansion of the packaging layer and that of other materials in the wafer assembly, particularly electrical interconnect materials. It is also possible to introduce properties to support such methods as photolithographic and low temperature processing of the packaging layer. This can improve fabrication accuracy and allows the packaging layer to be used with structures in a wafer assembly which might be damaged by high temperature processing, such as active optoelectronic devices and integrated circuits. Another major advantage is that the glass material can be used to provide optical characteristics as well as mechanical protection. The refractive index and other optical properties can be preselected and thus the glass material can be used for instance for waveguiding and index matching.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A substrate-based assembly for carrying optical components, the assembly comprising: a substrate; at least one active optical component and at least one passive optical component mounted on the substrate; a packaging layer formed on the substrate for protecting said optical components, the optical components and the packaging layer being carried by the substrate; wherein the packaging layer comprises at least two packaging layers, each of said packaging layers being at least one of (a) a planarization layer or (b) a passivation layer, at least one of the packaging layers comprising a hybrid glass material having both organic and inorganic components and being provided with a plurality of recesses, wherein each of the recesses has a wall surface therewithin supporting at least one of the optical components, each recess having a perimeter which is substantially closed, into which at least one of the components is mounted; and wherein the refractive index of a first of the at least two packaging layers is different from the refractive index of either a second of the at least two packaging layers or at least one of the optical components.
An optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
2. The substrate-based assembly according to claim 1 , wherein the hybrid glass material includes an organic component which polymerizes by cross-linking.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic) that includes an organic component that polymerizes by cross-linking. This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
3. The substrate-based assembly according to claim 1 , wherein the hybrid glass material includes an organic component which polymerizes under thermal or photo treatment.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic) that includes an organic component that polymerizes when exposed to heat or light. This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
4. The substrate-based assembly according to claim 1 , wherein the hybrid glass material includes at least one of an epoxy component, aluminium oxide and silicon oxide.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic) containing epoxy, aluminum oxide, or silicon oxide. This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
5. The substrate-based assembly according to claim 1 , wherein the hybrid glass material comprises an inorganic matrix provided at least in part by a metal alkoxide or salt, the metal alkoxide or salt each being hydrolyzed in provision of the inorganic matrix.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). The inorganic part of this hybrid glass is made from a metal alkoxide or salt which is hydrolyzed to form an inorganic matrix. This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
6. The substrate-based assembly according to claim 5 wherein the metal alkoxide or salt is based on groups 3A, 3B, 4B and/or 5B of the Periodic Table.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). The inorganic part of this glass is a hydrolyzed metal alkoxide or salt, based on elements from groups 3A, 3B, 4B, or 5B of the periodic table, forming an inorganic matrix. This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
7. The substrate-based assembly according to claim 1 , wherein the hybrid glass material includes at least one hydrocarbon compound from the group comprising acrylates, epoxides, alkyls, alkenes, and aromatic groups.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic) that contains at least one hydrocarbon compound (acrylates, epoxides, alkyls, alkenes, or aromatic groups). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
8. The substrate-based assembly according to claim 1 wherein the coefficient of thermal expansion of the at least one packaging layer approaches that of the substrate material.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The coefficient of thermal expansion (CTE) of at least one packaging layer is similar to the substrate material's CTE.
9. The substrate-based assembly according to claim 1 , wherein the at least one recess contains electrical interconnect material for providing electrical connection to at least one component packaged by the packaging layer.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess contains electrical interconnect material for electrical connection to components.
10. The substrate-based assembly according to claim 9 wherein the coefficient of thermal expansion of the at least one packaging layer approaches that of the electrical interconnect material.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess contains electrical interconnect material for electrical connection to components. The coefficient of thermal expansion (CTE) of at least one packaging layer is close to the CTE of the electrical interconnect material.
11. The substrate-based assembly according to claim 9 wherein the coefficient of thermal expansion of the at least one packaging layer differs from the coefficient of thermal expansion of the electrical interconnect material and/or the substrate material by not more than 15 parts per million.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess contains electrical interconnect material for electrical connection to components. The coefficient of thermal expansion (CTE) of the at least one packaging layer differs from the CTE of the electrical interconnect material and/or the substrate material by not more than 15 parts per million.
12. The substrate-based assembly according to claim 9 which further comprises at least one contact pad for a wire bond to the at least one component, the electrical interconnect material being present in said contact pad or wire bond.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess contains electrical interconnect material for electrical connection to components. The assembly also includes at least one contact pad for wire bonding to a component, with electrical interconnect material in the contact pad or wire bond.
13. The substrate-based assembly according to claim 9 which further comprises at least one mounting pad for mounting the at least one component, the electrical interconnect material being present in said mounting pad.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess contains electrical interconnect material for electrical connection to components. The assembly also includes at least one mounting pad for mounting the component, with the electrical interconnect material present in the mounting pad.
14. The substrate-based assembly according to claim 1 , wherein said at least one optical component comprises a bump bonded optical component.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one optical component is bump bonded.
15. The substrate-based assembly according to claim 1 wherein the material of the at least one packaging layer is lithographically patterned.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging layer is patterned using lithography.
16. The substrate-based assembly according to claim 15 wherein the material of the at least one packaging layer comprises at least one organic material which photopolymerizes, the at least one organic material being selected from the group comprising acrylates, epoxides, alkyls, alkenes, and aromatic groups.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging layer material is lithographically patterned and includes a photopolymerizing organic material (acrylates, epoxides, alkyls, alkenes, or aromatic groups).
17. The substrate-based assembly according to claim 1 wherein the packaging material has a processing temperature of not more than 450° C.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging material has a processing temperature of no more than 450°C.
18. The substrate-based assembly according to claim 1 wherein the packaging material has a processing temperature of not more than 200° C.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging material has a processing temperature of no more than 200°C.
19. The substrate-based assembly according to claim 1 wherein the packaging material has a processing temperature of not more than 150° C.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging material has a processing temperature of no more than 150°C.
20. The substrate-based assembly according to claim 17 wherein the packaging material is fabricated from a material comprising a polymerisation initiator.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging material, which has a processing temperature of no more than 450°C, contains a polymerization initiator.
21. The substrate-based assembly according to claim 1 having a substrate comprising at least one material from the group comprising silicon, glass, composite materials, ceramics and printed circuit board.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The substrate includes silicon, glass, composite materials, ceramics, or printed circuit board.
22. The substrate-based assembly according to claim 1 wherein the at least one packaging layer is a planarization layer.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer is a planarization layer.
23. The substrate-based assembly according to claim 22 wherein the planarization layer provides waveguiding.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. A planarization layer provides optical waveguiding.
24. The substrate-based assembly according to claim 1 wherein at least one of the recesses comprises an aperture to give access to an electrical interconnect structure.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One or more recesses has an opening to access an electrical connection.
25. The substrate-based assembly according to claim 22 wherein one or more components is/are mounted at least partially on the planarization layer.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. A planarization layer has one or more components mounted at least partially on it.
26. The substrate-based assembly according to claim 1 wherein the refractive index of a first of the at least two packaging layers is different from the refractive index of a second of the at least two packaging layers.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from the refractive index of another packaging layer. One packaging layer can act as a planarization layer or a passivation layer.
27. The substrate-based assembly according to claim 1 wherein the at least one packaging layer transmits optical radiation.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer transmits optical radiation.
28. The substrate-based assembly according to claim 1 wherein the packaging layer provides an alignment feature for use in aligning an optical component in the assembly.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer provides an alignment feature to align an optical component during assembly.
29. The substrate-based assembly according to claim 1 wherein the packaging layer, provides refractive index matching in use of the assembly.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer provides refractive index matching during use.
30. The substrate-based assembly according to claim 1 wherein the packaging layer, provides bonding between optical components in the assembly.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer provides bonding between optical components in the assembly.
31. The substrate-based assembly according to claim 1 wherein the active optical component comprises a laser or a tunable optical source.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The active optical component is a laser or tunable optical source.
32. The substrate-based assembly according to claim 1 wherein at least one of the recesses comprises an aperture to give access to an electrical interconnect structure and wherein the active optical component is bump-bonded or flip-chip mounted in the assembly to connect to the electrical interconnect structure.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess has an opening to access an electrical connection. The active optical component is bump-bonded or flip-chip mounted to connect to the electrical connection.
33. The substrate-based assembly according to claim 32 , wherein the active optical component comprises a laser or a tunable optical source, the assembly further comprising an optical modulator, external to the laser or tunable optical source.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. At least one recess has an opening to access an electrical connection. The active optical component (a laser or tunable optical source) is bump-bonded or flip-chip mounted to connect to the electrical connection. An optical modulator is located external to the laser or tunable optical source.
34. The substrate-based assembly according to claim 1 wherein the substrate-based assembly comprises a thick substrate-based assembly.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The assembly is a thick substrate-based assembly.
35. The substrate-based assembly according to claim 1 wherein the substrate-based assembly has a thickness in the range from 1 micron to 1 millimetre.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The assembly has a thickness between 1 micron and 1 millimeter.
36. Opto-electronic equipment comprising the substrate-based assembly according to claim 1 .
Opto-electronic equipment that contains the optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer.
37. The substrate-based assembly as in claim 1 , wherein the packaging layer provided with said one or more recesses is otherwise substantially continuous.
The optical component assembly includes a substrate supporting active and passive optical components. A packaging structure, made of at least two layers, protects these components. At least one of the packaging layers is a hybrid glass material (organic and inorganic). This layer has recesses that support the optical components. Each recess is mostly enclosed, securing a component. The refractive index of one packaging layer differs from another layer's refractive index or from an optical component's refractive index. One packaging layer can act as a planarization layer or a passivation layer. The packaging layer with the recesses is otherwise substantially continuous.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 19, 2003
September 10, 2013
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