A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A method of assembling an integrated circuit package, the method comprising: placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a plurality of non-conductive coating elements to the plurality of wire bonds, wherein each non-conductive coating element of the plurality of non-conductive coating elements is applied to a corresponding individual wire bond of the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds.
A method for assembling an integrated circuit (IC) package involves placing a die (the semiconductor chip) onto a substrate (the base) of the IC package. Electrical connections are made by attaching a series of wire bonds from connection points (bond pads) on the die to corresponding connection points on the substrate. A non-conductive coating is applied to each individual wire bond to prevent short circuits. Finally, the die and the coated wire bonds are encapsulated in a protective material.
2. The method of claim 1 , further comprising curing the plurality of non-conductive coating elements by heating the non-conductive material.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, applying a non-conductive coating to each individual wire bond to prevent short circuits, and encapsulating the die and wire bonds, further includes a step where the applied non-conductive coating elements are hardened or cured by heating the material.
3. The method of claim 1 , further comprising identifying one or more regions of wire bonds having a high density of wire bonds.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, applying a non-conductive coating to each individual wire bond to prevent short circuits, and encapsulating the die and wire bonds, further includes a step where regions with a high concentration of wire bonds are identified.
4. The method of claim 3 , wherein applying a plurality of non-conductive coating elements to the plurality of wire bonds comprises coating wire bonds in the one or more regions of wire bonds having a high density of wire bonds.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions with a high concentration of wire bonds, applying a non-conductive coating to each individual wire bond to prevent short circuits, and encapsulating the die and wire bonds, specifies that the non-conductive coating is specifically applied to the wire bonds located in the identified high-density regions.
5. The method of claim 1 , wherein applying a plurality of non-conductive coating elements to the plurality of wire bonds comprises coating a first portion of the plurality of wire bonds in a first application.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, applying a non-conductive coating to each individual wire bond to prevent short circuits, and encapsulating the die and wire bonds, specifies that only a first set or portion of the wire bonds are coated during an initial application of the non-conductive coating.
6. The method of claim 5 , further comprising coating a second portion of the plurality of wire bonds with a second plurality of non-conductive coating elements in a second application.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, applying a non-conductive coating to a first portion of wire bonds in a first application to prevent short circuits, and encapsulating the die and wire bonds, further involves coating a second set or portion of the wire bonds with a second application of the non-conductive coating.
7. The method of claim 6 , wherein coating a second portion of the plurality of wire bonds with a second plurality of non-conductive coating elements in a second application comprises coating the second portion of the plurality of wire bonds if the plurality of wire bonds exceeds a predetermined length.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, applying a non-conductive coating to a first portion of wire bonds in a first application to prevent short circuits, coating a second portion of wire bonds with a second application of non-conductive coating, and encapsulating the die and wire bonds, specifies that the second portion of wire bonds is coated only if the wire bonds are longer than a defined length.
8. A method of assembling an integrated circuit package, the method comprising: placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; identifying a region of the plurality of wire bonds of an integrated circuit requiring protection against shorting; and selectively applying a plurality of non-conductive coating elements to the region of the plurality of wire bonds, wherein each non-conductive coating element of the plurality of non-conductive coating elements is applied to a corresponding individual wire bond of the plurality of wire bonds.
A method for assembling an integrated circuit (IC) package involves placing a die on a substrate. Wire bonds connect the die's bond pads to the substrate's bond pads. A specific area where the wire bonds are vulnerable to shorting is identified. A non-conductive coating is then selectively applied to each individual wire bond in that identified region to prevent electrical shorts.
9. The method of claim 8 , further comprising curing the plurality of non-conductive coating elements by heating the plurality of non-conductive coating elements.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, and selectively applying a non-conductive coating to each individual wire bond in that identified region, further includes hardening or curing the applied non-conductive coating by heating the coating elements.
10. The method of claim 8 , wherein identifying a region of the plurality of wire bonds of an integrated circuit comprises identifying a region of the plurality of wire bonds having a predetermined density of wire bonds.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, and selectively applying a non-conductive coating to each individual wire bond in that identified region, specifies that identifying the vulnerable region involves finding an area where the wire bonds are densely packed together.
11. The method of claim 8 , wherein identifying a region of the plurality of wire bonds of an integrated circuit comprises identifying a region of the plurality of wire bonds having a predetermined length.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, and selectively applying a non-conductive coating to each individual wire bond in that identified region, specifies that identifying the vulnerable region involves finding an area where the wire bonds are longer than a defined length.
12. The method of claim 8 , wherein selectively applying a plurality of non-conductive coating elements to the region of the plurality of wire bonds comprises coating a first portion of the plurality of wire bonds with the plurality of non-conductive coating elements in a first application.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, and selectively applying a non-conductive coating to each individual wire bond in that identified region, involves coating only a first portion of the wire bonds in the identified region during a first application of the non-conductive coating.
13. The method of claim 12 , further comprising coating a second portion of the plurality of wire bonds with a second plurality of non-conductive coating elements in a second application.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, selectively applying a non-conductive coating to a first portion of wire bonds in that identified region during a first application, further involves coating a second portion of the wire bonds with a second application of the non-conductive coating.
14. The method of claim 8 , further comprising encapsulating the die and the plurality of wire bonds.
The method of assembling an integrated circuit package, which involves placing a die on a substrate, coupling wire bonds between the die and substrate, identifying regions requiring shorting protection, selectively applying a non-conductive coating to each individual wire bond in that identified region, further includes encapsulating the die and the coated wire bonds in a protective material.
15. An integrated circuit package, comprising: a substrate; at least one die positioned on the substrate; and a plurality of wire bonds coupling a plurality of bond pads on the at least one die to corresponding bond pads on the substrate; wherein at least a portion of the plurality of wire bonds are coated with a corresponding plurality of non-conductive coating elements to prevent shorting between wire bonds of the plurality of wire bonds, wherein each non-conductive coating element of the plurality of non-conductive coating elements is applied to a corresponding individual wire bond of the plurality of wire bonds.
An integrated circuit (IC) package contains a substrate and a die positioned on it. Wire bonds electrically connect bond pads on the die to corresponding bond pads on the substrate. A non-conductive coating is applied to at least some of the individual wire bonds to prevent them from shorting together.
16. The integrated circuit package of claim 15 , wherein the plurality of wire bonds is in a region of wire bonds having a predetermined density.
The integrated circuit package, which includes a substrate, a die on the substrate, and wire bonds connecting the die and substrate with a non-conductive coating applied to at least some wire bonds to prevent shorting, specifies that the coated wire bonds are located in a region where the wire bonds are packed together with a certain minimum density.
17. The integrated circuit package of claim 15 , wherein the at least a portion of the plurality of wire bonds is coated with a first coating on first segments of the plurality of wire bonds and with a second coating on second segments of the plurality of wire bonds.
The integrated circuit package, which includes a substrate, a die on the substrate, and wire bonds connecting the die and substrate with a non-conductive coating applied to at least some wire bonds to prevent shorting, specifies that the coated wire bonds have a first coating on some sections of the wire and a second, different coating on other sections of the wire.
18. The integrated circuit package of claim 15 , wherein, for each wire bond of the plurality of wire bonds having the non-conductive coating elements, a bead is formed on the wire bond.
The integrated circuit package, which includes a substrate, a die on the substrate, and wire bonds connecting the die and substrate with a non-conductive coating applied to at least some wire bonds to prevent shorting, specifies that the non-conductive coating forms a bead shape on each coated wire bond.
19. The integrated circuit package of claim 15 , wherein the at least a portion of the plurality of wire bonds comprises a first plurality of wire bonds in a first region and a second plurality of wire bonds in a second region.
The integrated circuit package, which includes a substrate, a die on the substrate, and wire bonds connecting the die and substrate with a non-conductive coating applied to at least some wire bonds to prevent shorting, specifies that the coated wire bonds are in a first area of the package and other coated wire bonds are in a separate, second area.
20. The integrated circuit package of claim 15 , wherein the non-conductive coating elements comprise an epoxy.
The integrated circuit package, which includes a substrate, a die on the substrate, and wire bonds connecting the die and substrate with a non-conductive coating applied to at least some wire bonds to prevent shorting, specifies that the non-conductive coating is made of epoxy.
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January 10, 2012
September 17, 2013
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