Patentable/Patents/US-8549741
US-8549741

Suspension method for compliant thermal contact of electronics modules

PublishedOctober 8, 2013
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

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Patent Metadata

Filing Date

May 22, 2009

Publication Date

October 8, 2013

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Cite as: Patentable. “Suspension method for compliant thermal contact of electronics modules” (US-8549741). https://patentable.app/patents/US-8549741

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