The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for dispensing solder on a substrate, the method in sequence comprising: A) heating a substrate to a temperature which lies above a melting temperature of the solder; B) dispensing at least one solder portion on a surface of the substrate; C) after dispensing the at least one solder portion, contacting and lowering a pin into the solder portion until the pin touches the surface of the substrate; D) applying a predetermined force to the pin, so that the pin presses against the substrate; E) applying ultrasonic sound to the pin in such a way that ultrasonic waves are produced in the pin which are directed perpendicularly or angularly in relation to the surface of the substrate; F) moving the pin along a predetermined path which extends parallel to said surface of the substrate, wherein during the moving the pin is located in the solder and ultrasonic sound is applied to the pin; G) terminating the application of ultrasonic sound to the pin after the moving; and then H) lifting the pin until the pin has been severed from the solder portion.
2. The method according to claim 1 , wherein said moving the pin along a predetermined path comprises cooling the pin to a temperature which is at least 10 K lower than the melting temperature of the solder and which lies above a solidus temperature of the solder.
3. The method according to claim 1 , further comprising holding the substrate at a temperature during the steps C to F which is at least 10 K lower than the melting temperature of the solder and which lies above a solidus temperature of the solder.
4. The method according to claim 1 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
5. The method according to claim 2 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
6. The method according to claim 3 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
7. The method according to claim 1 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
8. The method according to claim 2 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
9. A method for mounting semiconductor chips on a substrate, the method in sequence comprising: A) heating a substrate to a temperature which lies above a melting temperature of the solder; B) dispensing at least one solder portion on a surface of the substrate; C) after dispensing the at least one solder portion, contacting and lowering a pin into the solder portion until the pin touches the surface of the substrate; D) applying a predetermined force to the pin, so that the pin presses against the substrate; E) applying ultrasonic sound to the pin in such a way that ultrasonic waves are produced in the pin which are directed perpendicularly or angularly in relation to the surface of the substrate; F) moving the pin along a predetermined path which extends parallel to said surface of the substrate, wherein during the moving the pin is located in the solder and ultrasonic sound is applied to the pin; G) terminating the application of ultrasonic sound to the pin after the moving; and then H) lifting the pin until the pin has been severed from the solder portion, and I) placing a semiconductor chip on the solder portion.
10. The method according to claim 9 , wherein said moving the pin along a predetermined path comprises cooling the pin to a temperature which is at least 10 K lower than the melting temperature of the solder and which lies above a solidus temperature of the solder.
11. The method according to claim 9 , further comprising holding the substrate at a temperature during the steps C to F which is at least 10 K lower than the melting temperature of the solder and which lies above a solidus temperature of the solder.
12. The method according to claim 9 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
13. The method according to claim 10 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
14. The method according to claim 11 , wherein in step B the solder is dispensed on a substrate place and wherein said moving the pin along a predetermined path includes moving the pin at least partly along an edge of the substrate place, with a contact surface of the pin protruding beyond the substrate place and thereby touching the substrate place only partly.
15. The method according to claim 9 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
16. The method according to claim 10 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
17. The method according to claim 11 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
18. The method according to claim 12 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
19. The method according to claim 13 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
20. The method according to claim 14 , wherein in the case of a single solder portion a diameter of the pin is smaller than a mean diameter of the solder portion.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 17, 2012
November 5, 2013
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