Camera module and method of manufacturing the same

1. A camera module comprising: a lens unit including a casing portion and a lens; and a substrate portion on which an image pick-up element is mounted, wherein the camera module is assembled in combination of the lens unit and the substrate portion in an arrangement in which the lens and the image pick-up element are opposed to each other, wherein the substrate portion includes: a first substrate made of a resin; the image pick-up element mounted on the first substrate; an infrared filter supported on a light receiving face of the image pick-up element via a frame-shaped adhesive, a space between the infrared filter and the light receiving face of the image pick-up element being sealed by the frame-shaped adhesive; and a second substrate made of a resin supported on a surface of the infrared filter which is opposed to the lens, wherein the second substrate includes an opening portion extending entirely through a thickness of the second substrate and disposed in alignment with the infrared filter so as not to intercept an incident light, wherein a circuit component is mounted on the second substrate, wherein a resin is filled between the second substrate and the first substrate up to outer peripheries of the infrared filter, the frame-shaped adhesive and the image pick-up element; wherein the first substrate includes first pads and second pads, the first pads are connected to pads of the image pick-up element, and the second pads are connected to pads of the second substrate, wherein the infrared filter is provided on the image pick-up element within a region surrounded by the pads of the image pick-up element, as viewed from above, wherein the pads of the image pick-up element and the first pads of the first substrate are connected by bonding wires, and the resin covers the bonding wires and the pads of the image pick-up element, wherein the second substrate is bonded to the infrared filter via another adhesive which is provided around the peripheral edge portion of the infrared filter, and wherein the lens unit is provided above the second substrate, and the circuit component is mounted on the second substrate within a region surrounded by a contact portion between the lens unit and the second substrate.

2. The camera module according to claim 1 , wherein an electrode to be connected to a mounting substrate is provided on a mounting surface of the first substrate, wherein a first pad and a second pad disposed on a surface which is opposite to the mounting surface of the first substrate are electrically connected to the electrode via a through hole portion provided on the first substrate, wherein the first pad and the image pick-up element are electrically connected to each other, and wherein the second pad and the second substrate are electrically connected to each other.

3. The camera module according to claim 2 , wherein the first pad and the image pick-up element are subjected to wire bonding, and wherein the second pad and the second substrate are subjected to the wire bonding.

4. The camera module according to claim 3 , wherein a slit hole is provided on the second substrate, and the second substrate and the first substrate are subjected to the wire bonding via the slit hole.

5. A method of manufacturing a camera module comprising: bonding an image pick-up element to one of surfaces of a first substrate made of a resin and formed to be large-sized; bonding an infrared filter onto a light receiving face of the image pick-up element; wire bonding an electrode terminal exposed to a peripheral edge portion of the image pick-up element to which the infrared filter is bonded, and a first pad formed on the first substrate; bonding a second substrate made of a resin onto the infrared filter in alignment of an opening portion extending entirely through a thickness of the second substrate so as not to intercept an incident light after the wire bonding step; wire bonding the second substrate and a second pad formed on the first substrate; filling a resin in a region interposed between the first substrate and the second substrate over outer peripheries of the image pick-up element and the infrared filter; cutting a large-sized substrate formed by the first substrate and the second substrate into individual pieces and forming a substrate portion to be the individual piece; assembling the camera module including bonding the substrate portion to a lens unit; wherein the electrode terminal of the image pickup element comprises a plurality of electrode terminals, the first pad of the first substrate comprises a plurality of first pads, and the second pad of the first substrate comprises a plurality of second pads, the method further comprising: wire bonding the first pads to the electrode terminals of the image pick-up element; connecting the second pads to pads of the second substrate; providing the infrared filter on the image pick-up element within a region surrounded by the electrode terminals of the image pick-up element, as viewed from above; covering the bonding wires and the electrode terminals of the image pick-up element with the resin; bonding the second substrate to the infrared filter via another adhesive which is provided around the peripheral edge portion of the infrared filter; and providing a lens unit above the second substrate, and mounting a circuit component on the second substrate within a region surrounded by a contact portion between the lens unit and the second substrate.

6. The method of manufacturing the camera module according to claim 5 , wherein, in the first substrate, an electrode to be connected to a mounting substrate is formed on a mounting surface of the first substrate, the first pad and the second pad are formed on a surface which is opposite to the mounting surface, and a through hole portion for electrically connecting the electrode to the first pad is formed.