In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A connection structure of an electronic component and a wired circuit board, the structure comprising: the electronic component including a plurality of external terminals, and the wired circuit board including a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer, the conductive pattern including a plurality of terminal portions for connection with the plurality of external terminals, wherein the terminal portions are arranged in a terminal forming portion and along the width direction that is perpendicular to the longitudinal direction of the metal supporting board with a space provided therebetween, wherein the metal supporting board is cut out at the terminal forming portion so as to sandwich the plurality of terminal portions in the width direction, wherein the electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other, wherein the wired circuit board is bent so that the conductive pattern is warped, and by reaction force of the warping, the plurality of terminal portions and the plurality of external terminals are abutted, and wherein the electronic component and the wired circuit board are electrically connected.
2. The connection structure of an electronic component and a wired circuit board according to claim 1 , wherein by the spring force of the metal supporting board, the plurality of terminal portions are abutted on the plurality of external terminals.
3. A method for testing an electronic component comprising the steps of: preparing an electronic component including a plurality of external terminals, preparing a wired circuit board including a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer, the conductive pattern including a plurality of terminal portions for connection with the plurality of external terminals, the terminal portions being arranged in a terminal forming portion and along the width direction that is perpendicular to the longitudinal direction of the metal supporting board with a space provided therebetween, and the metal supporting board being cut out at the terminal forming portion so as to sandwich the plurality of terminal portions in the width direction, disposing the electronic component and the wired circuit board so that the plurality of external terminals and the plurality of terminal portions face each other, bending the wired circuit board so that the conductive pattern is warped, allowing the plurality of terminal portions and the plurality of external terminals to be abutted by the reaction force of the warping, and testing electrical characteristics of the electronic component through the wired circuit board.
4. A method for connecting an electronic component with a wired circuit board, wherein the electronic component includes a plurality of external terminals, and wherein the wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer, the conductive pattern including a plurality of terminal portions for connection with the plurality of external terminals, the terminal portions being arranged in a terminal forming portion of the wired circuit board and along the width direction that is perpendicular to the longitudinal direction of the metal supporting board with a space provided therebetween, and the metal supporting board being cut out at the terminal forming portion so as to sandwich the plurality of terminal portions in the width direction, the method comprising the steps of: disposing the electronic component and the wired circuit board such that the plurality of external terminals and the plurality of terminal portions face each other, and bending the wired circuit board so that the conductive pattern is warped, and allowing the plurality of terminal portions and the plurality of external terminals to be abutted by reaction force of the warping, thereby electrically connecting the electronic component with the wired circuit board.
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November 18, 2010
December 31, 2013
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