A wafer level chip scale package (WLCSP) includes a semiconductor device including an active surface having a contact pad, and side surfaces. A mold covers the side surfaces of the semiconductor device. A RDL structure includes a first PPI line electrically connected to the contact pad and extending on the active surface of the semiconductor device. A UBM layer is formed over and electrically connected to the first PPI line. A seal ring structure extends around the upper periphery of the semiconductor device on the mold. The seal ring structure includes a seal layer extending on the same level as at least one of the first PPI line and the UBM layer. A method of manufacturing a WLCSP includes forming a re-routing laminated structure by simultaneously forming an interconnection line and a seal layer on the molded semiconductor devices.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A package, comprising: a semiconductor device including an active surface having a contact pad, and side surfaces; a mold covering the side surfaces of the semiconductor device; a redistribution layer (RDL) structure including a first post-passivation interconnection (PPI) line electrically connected to the contact pad and extending on the active surface of the semiconductor device; an under-bump metallurgy (UBM) layer over and electrically connected to the first PPI line; and a seal ring structure extending around and outside the upper periphery of the semiconductor device on the mold, the seal ring structure including a seal layer extending on the same level as at least one of the first PPI line and the UBM layer.
2. The package of claim 1 , wherein the seal ring structure includes a top seal layer extending on the same level as and spaced apart from the UBM layer.
3. The package of claim 2 , wherein the top seal layer and the UBM layer comprise the same material.
4. The package of claim 2 , wherein the seal ring structure further includes a lower seal layer connected to the top seal layer, and extended on the same level as the first PPI line.
5. The package of claim 4 , wherein the lower seal layer and the first PPI line comprise the same material.
6. The package of claim 4 , wherein the lower seal layer extends on the mold and on the active surface of the semiconductor device.
7. The package of claim 4 , wherein the semiconductor device further includes a chip seal ring having a seal contact pad, and wherein the lower seal layer is in contact with the seal contact pad.
8. The package of claim 2 , wherein the RDL structure further includes a second PPI line electrically connected to the first PPI line and to the UBM layer, and wherein the seal ring structure further includes: a first lower seal layer extended on the same level as the first PPI line; and a second lower seal layer connected to the first lower seal layer and the top seal layer, and extended on the same level as the second PPI line.
9. The package of claim 8 , wherein the seal ring structure further includes a bottom seal layer connected to the first lower seal layer and being in contact with the mold.
10. The package of claim 9 , wherein the semiconductor device further includes a chip seal ring having a seal contact pad, and wherein the bottom seal layer is in contact with the seal contact pad.
11. The package of claim 1 , further comprising a solder ball on and electrically connected to the UBM layer.
12. The package of claim 11 , wherein the seal ring structure extends directly on the mold.
13. A package, comprising: a molded semiconductor device including a die having a contact pad; a re-routing laminated structure formed on the molded semiconductor device, and having a redistribution layer (RDL) structure being electrically connected to the contact pad; and a seal ring structure formed within and on the re-routing laminated structure, and extending around and outside the upper periphery of the die.
14. The package of claim 13 , wherein the semiconductor device includes a circuit area and a chip seal ring surrounding the circuit area, and the seal ring structure extends directly on the mold and surrounds the chip seal ring.
15. A method of manufacturing a wafer level chip scale package (WLCSP), comprising: forming a molded semiconductor device including a semiconductor device and a mold covering side surfaces of the semiconductor device, the semiconductor device including an active surface having a contact pad; and forming a re-routing laminated structure by simultaneously forming an interconnection line and a seal layer on the molded semiconductor device, the interconnection line being electrically connected to the contact pad, the seal layer being spaced apart from the interconnection line and extending on the mold, the seal layer extending outside an upper periphery of the semiconductor device.
16. The method of claim 15 , wherein the forming of the re-routing laminated structure comprises: forming the seal layer extending around and outside the upper periphery of the semiconductor device on the mold.
17. The method of claim 15 , wherein the forming of the re-routing laminated structure comprises: forming a first insulation layer having a first via opening and a second via opening on the molded semiconductor device; and simultaneously forming the interconnection line and the seal layer, the interconnection line extending on the first insulation layer and within the first via opening, the seal layer extending on the first insulation layer and within the second via opening.
18. The method of claim 17 , wherein the forming of the first insulation layer comprises: simultaneously forming the first via opening and the second via opening in the first insulation layer, the first via opening exposing the contact pad, the second via opening exposing the mold.
19. The method of claim 17 , wherein the semiconductor device includes a chip seal ring having a seal contact pad, wherein the forming of the first insulation layer comprises: simultaneously forming the first via opening and the second via opening, the first via opening exposing the contact pad, the second via opening exposing the seal contact pad, and wherein the simultaneously forming of the interconnection line and the seal layer comprises forming the seal layer being in contact with the seal contact pad.
20. The method of claim 17 , before the forming of the first insulation layer, further comprising: forming a bottom seal layer being in contact with the mold and with the active surface of the semiconductor device.
21. The method of claim 15 , wherein the forming of the re-routing laminated structure comprises: forming a first insulation layer on the molded semiconductor device; simultaneously forming a first post-passivation interconnection (PPI) line and a first lower seal layer on the first insulation layer, the first PPI line being electrically connected to the contact pad, the first lower seal layer being spaced apart from the first PPI line and extending on the mold; forming a second insulation layer on the first PPI line and the first lower seal layer; and simultaneously forming a second PPI line and a second lower seal layer on the second insulation layer, the second PPI line being electrically connected to the first PPI line, the second lower seal layer being spaced apart from the second PPI line and being connected to the first lower seal layer.
22. The method of claim 15 , further comprising: simultaneously forming an under-bump metallurgy (UBM) layer and a top seal layer on the re-routing laminated structure, the UBM layer being electrically connected to the interconnection line, the top seal layer being spaced apart from the UBM layer and being connected to the seal layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 5, 2011
January 7, 2014
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