Stress-engineered interconnect packages with activator-assisted molds

1. A method, comprising: providing a pad chip having contact pads; providing a spring chip having micro-springs; applying a chemical activator to one of either the pad chip or the spring chip; applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip; aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads; and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

2. The method of claim 1 , wherein the chemical activator is applied to the pad chip and the adhesive is applied to the spring chip.

3. The method of claim 1 , wherein applying the chemical activator comprises one of painting, spraying or spinning the chemical activator.

4. The method of claim 1 , wherein the chemical activator completely cures the adhesive.

5. The method of claim 1 , further comprising exposing the adhesive to UV light to completely cure the adhesive.

6. The method of claim 1 , further comprising placing one of spacer pillars or spacer walls on one of either the pad chip or the spring chip.

7. The method of claim 1 , further comprising etching alignment pits into at least one of the pad chip or the spring chip, and placing spacer beads into the alignment pits.