A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device, characterized by comprising: a substrate; an insulating substrate mounted on the substrate; a metal layer formed on the insulating substrate; an electronic part mounted on the metal layer across a bond; and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal layer and around the electronic part.
2. The semiconductor device according to claim 1 , characterized in that the wire member is disposed between the electronic part and an edge of the metal layer.
3. The semiconductor device according to claim 2 , characterized in that the wire member has a wire portion, and the wire portion extends along the edge of the metal layer.
4. The semiconductor device according to claim 2 , characterized in that the wire member has a bonding portion, and a plurality of the bonding portions are disposed aligned along the edge of the metal layer.
5. The semiconductor device according to claim 2 , characterized in that the electronic part is an external connection terminal.
6. The semiconductor device according to claim 1 , characterized in that another electronic part is mounted on the metal layer across a bond, and the wire member is disposed between the electronic part and the other electronic part.
7. The semiconductor device according to claim 6 , characterized in that the wire member has a wire portion, and the wire portion extends in a direction crossing the direction joining the electronic part and other electronic part.
8. The semiconductor device according to claim 6 , characterized in that the wire member has a bonding portion, and a plurality of the bonding portions are disposed aligned in a direction crossing the direction joining the electronic part and other electronic part.
9. The semiconductor device according to claim 6 , characterized in that the electronic part is an external connection terminal, and the other electronic part is a semiconductor element.
10. The semiconductor device according to claim 6 , characterized in that each of the electronic part and the other electronic part is a semiconductor element.
11. The semiconductor device according to claim 1 , characterized in that the bond is solder.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 8, 2011
March 4, 2014
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