A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device, comprising: a first flexible substrate having opposing first and second main surfaces extending between first and second peripheral edges, at least one first die being attached on one of the first or second main surfaces of the first flexible substrate in electrical connection with a first plurality of metal traces formed on the first flexible substrate; a second flexible substrate having opposing first and second main surfaces extending between first and second peripheral edges, at least one second die being attached on one of the first or second main surfaces of the second flexible substrate in electrical connection with a second plurality of metal traces formed on the second flexible substrate, the second flexible substrate being oriented such that one of the main surfaces thereof faces one of the main surfaces of the first flexible substrate; a first crimping structure electrically connecting at least one of the first plurality of metal traces to at least one of the second plurality of metal traces and crimping together the first peripheral edges of the first and second flexible substrates; and a second crimping structure electrically connecting at least one of the first plurality of metal traces to at least one of the second plurality of metal traces and crimping together the second peripheral edges of the first and second flexible substrates.
2. The device of claim 1 , wherein the first and second crimping structures are crimping plates extending through each of the first and second flexible substrates.
3. The device of claim 2 , further comprising: a third flexible substrate having opposing first and second main surfaces extending between first and second peripheral edges, at least one third die being attached on one of the first or second main surfaces of the third flexible substrate in electrical connection with a third plurality of metal traces formed on the third flexible substrate, the third flexible substrate being oriented such that one of the main surfaces thereof faces one of the main surface of the first flexible substrate, wherein the first crimping plate extends through the first, second, and third substrates, electrically connects at least one of the first, second, and third pluralities of metal traces to each other, and crimps together the first peripheral edges of the first, second, and third flexible substrates, and wherein the second crimping plate extends through the first, second, and third substrates, electrically connects at least one of the first, second, and third pluralities of metal traces to each other, and crimps together the second peripheral edges of the first, second, and third flexible substrates.
4. The device of claim 1 , wherein the first and second crimping structures are crimping pins each connected to one of the main surfaces of the first flexible substrate and one of the main surfaces of the second flexible substrate.
5. The device of claim 4 , wherein the first and second flexible substrates each include electrical pads to which the respective first and second crimping pins are electrically connected.
6. The device of claim 1 , further comprising: a plurality of the first crimping structures, each electrically connecting at least one of the first plurality of metal traces to at least one of the second plurality of metal traces and crimping together the first peripheral edges of the first and second flexible substrates; and a plurality of the second crimping structures, each electrically connecting at least one of the first plurality of metal traces to at least one of the second plurality of metal traces and crimping together the second peripheral edges of the first and second flexible substrates.
7. The device of claim 1 , wherein the second main surface of the first flexible substrate faces the first main surface of the second flexible substrate, and wherein the at least one first die is attached on the first main surface of the first flexible substrate and the at least one second die is attached on the second main surface of the second flexible substrate.
8. The device of claim 1 , wherein the second main surface of the first flexible substrate faces the first main surface of the second flexible substrate, and the device further comprises a ball grid array formed on one of the first main surface of the first flexible substrate or the second main surface of the second flexible substrate.
9. The device of claim 1 , wherein the at least one first die and the at least one second die are each encapsulated in a packaging material.
10. A method of assembling a semiconductor device, the method comprising: attaching at least one first die on one of a first main surface or an opposing second main surface of a first flexible substrate, the first and second main surfaces of the first flexible substrate extending between first and second peripheral edges thereof; electrically connecting the at least one first die to a first plurality of metal traces formed on the first flexible substrate; attaching at least one second die on one of a first main surface or an opposing second main surface of a second flexible substrate, the first and second main surfaces of the second flexible substrate extending between first and second peripheral edges thereof; electrically connecting the at least one second die to a second plurality of metal traces formed on the second flexible substrate; orienting the second flexible substrate such that one of the main surfaces thereof faces one of the main surfaces of the first flexible substrate; crimping together the first peripheral edges of the first and second flexible substrates with a first crimping structure that electrically connects at least one of the first plurality of metal traces to at least one of the second plurality of metal traces; and crimping together the second peripheral edges of the first and second flexible substrates with a second crimping structure that electrically connects at least one of the first plurality of metal traces to at least one of the second plurality of metal traces.
11. The method of claim 10 , wherein the first and second crimping structures are crimping plates, and crimping the first and second peripheral edges includes penetrating the first and second substrates with first and second crimping plates.
12. The method of claim 11 , further comprising: attaching at least one third die on one of a first main surface or an opposing second main surface of a third flexible substrate, the first and second main surfaces of the third flexible substrate extending between first and second peripheral edges thereof; electrically connecting the at least one third die to a third plurality of metal traces formed on the third flexible substrate; and orienting the third flexible substrate such that one of the main surfaces thereof faces one of the main surfaces of the first flexible substrate, wherein crimping of the first peripheral edges further includes penetrating the third flexible substrate with the first crimping plates to crimp together the first peripheral edges of the first, second, and third flexible substrates and electrically connect at least one of the first, second, and third pluralities of metal traces to each other, and wherein crimping of the second peripheral edges further includes penetrating the third flexible substrate with the second crimping plates to crimp together the second peripheral edges of the first, second, and third flexible substrates and electrically connect at least one of the first, second, and third pluralities of metal traces to each other.
13. The method of claim 10 , wherein the first and second crimping structures are crimping pins and crimping of the first and second peripheral edges includes connecting each of the first and second crimping pins to one of the main surfaces of the first flexible substrate and one of the main surfaces of the second flexible substrate.
14. The method of claim 13 , further comprising forming electrical pads on the first and second flexible substrates to which the first and second crimping pins are respectively electrically connected.
15. The method of claim 10 , wherein the second main surface of the first flexible substrate faces the first main surface of the second flexible substrate, the method further comprising: attaching the at least one first die on the first main surface of the first flexible substrate and attaching the at least one second die on the second main surface of the second flexible substrate.
16. The method of claim 10 , wherein the second main surface of the first flexible substrate faces the first main surface of the second flexible substrate, the method further comprising: forming a ball grid array on one of the first main surface of the first flexible substrate or the second main surface of the second flexible substrate.
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May 23, 2013
April 15, 2014
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