A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of making a plurality of finger sensor packages comprising: advancing a flexible circuit tape along a predetermined path of travel, the flexible circuit tape comprising a flexible layer and conductive traces thereon defining a plurality of individual flexible circuits; and performing the following steps as the flexible circuit tape is advanced along the path of travel securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each individual flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define a plurality of finger sensor packages, and stamping out the plurality of finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.
2. The method according to claim 1 wherein each individual flexible circuit comprises an extension portion extending outwardly from the corresponding sensor package frame.
3. The method according to claim 2 wherein performing the following steps further comprises securing a respective stiffener member on a distal end of the extension portion of the corresponding individual flexible circuit.
4. The method according to claim 1 wherein the at least one flush common edge comprises three flush common edges.
5. The method according to claim 1 wherein the at least one fluid fill material comprises at least one curable fluid fill material; and further comprising curing the at least one curable fluid fill material prior to stamping.
6. The method according to claim 1 wherein the at least one fluid fill material comprises: an underfill fluid material applied between the individual flexible circuit and adjacent portions of each finger sensing IC; and a backfill fluid material applied between each sensor package frame and adjacent portions of the corresponding finger sensing IC.
7. The method according to claim 1 wherein securing the sensor package frame comprises securing using an adhesive.
8. The method according to claim 1 wherein each finger sensing IC comprises a plurality of finger sensing pixels opposing adjacent portions of the corresponding individual flexible circuit.
9. The method according to claim 1 wherein each sensor package frame has a rectangular shape.
10. The method according to claim 1 wherein each finger sensing IC comprises a plurality of bond pads connected to corresponding ones of the plurality of conductive traces.
11. A method of making a finger sensor package comprising: securing a finger sensing integrated circuit (IC) to a flexible circuit, the flexible circuit comprising a flexible layer and a plurality of conductive traces thereon; securing a sensor package frame to the flexible circuit and surrounding the finger sensing IC; applying at least one fluid fill material adjacent the finger sensor IC while using the sensor package frame as a dam; and trimming at least one edge of the flexible circuit and sensor package frame to make the finger sensor package having at least one flush common edge between the sensor package frame and flexible circuit.
12. The method according to claim 11 wherein the flexible circuit comprises an extension portion extending outwardly from the sensor package frame.
13. The method according to claim 12 further comprising securing a respective stiffener member on a distal end of the extension portion of the flexible circuit.
14. The method according to claim 11 wherein the at least one flush common edge comprises three flush common edges.
15. The method according to claim 11 wherein the at least one fluid fill material comprises at least one curable fluid fill material; and further comprising curing the at least one curable fluid fill material prior to trimming.
16. The method according to claim 11 wherein the at least one fluid fill material comprises: an underfill fluid material applied between the flexible circuit and adjacent portions of the finger sensing IC; and a backfill fluid material applied between the sensor package frame and adjacent portions of the finger sensing IC.
17. The method according to claim 11 wherein securing the sensor package frame comprises securing using an adhesive.
18. The method according to claim 11 wherein the finger sensing IC comprises a plurality of finger sensing pixels opposing adjacent portions of the flexible circuit.
19. The method according to claim 11 wherein the sensor package frame has a rectangular shape.
20. The method according to claim 11 wherein the finger sensing IC comprises a plurality of bond pads connected to corresponding ones of the plurality of conductive traces.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 5, 2010
April 22, 2014
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