According to an embodiment, a semiconductor integrated circuit including first and second lower-layer power supply wires extending in a first direction and first and second upper-layer power supply wires extending in a second direction is provided. First and second connection wires between the upper-layer power supply wires and the lower-layer power supply wires are arranged in a same line along the second direction. First and second position converting wires extending from the connection wires are arranged between the first and second connection wires. First and second upper-side vias provided on the position converting wires are arranged in a same line along the first direction.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A power supply wiring structure, comprising: a first lower-layer power supply wire and a second lower-layer power supply wire extended in a first direction in a lower wiring layer; a first upper-layer power supply wire and a second upper-layer power supply wire extended in a second direction substantially perpendicular to the first direction in a plane view in an upper wiring layer; a first connection portion connecting the first upper-layer power supply wire and the first lower-layer power supply wire; and a second connection portion connecting the second upper-layer power supply wire and the second lower-layer power supply wire, wherein the first connection portion includes: a first connection wire formed in a predetermined wiring layer between the lower wiring layer and the upper wiring layer and positioned above the first lower-layer power supply wire, a first lower-side via that is provided below the first connection wire, and connects the first connection wire and the first lower-layer power supply wire, a first position converting wire connected to the first connection wire and extending along the second direction, and a first upper-side via that is provided above the first position converting wire, and connects the first position converting wire and the first upper-layer power supply wire, the second connection portion includes: a second connection wire formed in the predetermined wiring layer and positioned above the second lower-layer power supply wire, a second lower-side via that is provided below the second connection wire, and connects the second connection wire and the second lower-layer power supply wire, a second position converting wire connected to the second connection wire, extending along the second direction, and provided closer to the second upper-layer power supply wire than the first connection wire in the plane view, and a second upper-side via that is provided above the second position converting wire, and connects the second position converting wire and the second upper-layer power supply wire, the first upper-side via and the second upper-side via are arranged in a same line along the first direction.
2. The power supply wiring structure according to claim 1 , wherein the first upper-side via and the second upper-side via are arranged in the position between the first lower-layer power supply wire and the second lower-layer power supply wire in the plane view.
3. The power supply wiring structure according to claim 1 , wherein an overall shape combining the first connection wire and the first position converting wire in the plane view and the overall shape combining the second connection wire and the second position converting wire in the plane view exhibit an L shape.
4. The power supply wiring structure according to claim 1 , wherein an overall shape combining the first connection wire and the first position converting wire in the plane view and the overall shape combining the second connection wire and the second position converting wire in the plane view exhibit a T shape.
5. The power supply wiring structure according to claim 1 , wherein the first lower-layer power supply wire and the first upper-layer power supply wire are VDD wires used to supply a power supply potential.
6. The power supply wiring structure according to claim 1 , wherein the second lower-layer power supply wire and the second upper-layer power supply wire are VSS wires used to supply an earth potential.
7. The power supply wiring structure according to claim 1 , further comprising: interlayer dielectrics provided between the predetermined wiring layer and the first and second lower-layer power supply wires, wherein a plurality of the first and second lower-side vias is provided so as to cut through the interlayer dielectrics.
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March 15, 2012
June 10, 2014
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