Patentable/Patents/US-8774734
US-8774734

Module that can be used as a plug-in module and as a solder-down module

PublishedJuly 8, 2014
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A modular device includes a first printed circuit board and a wireless transceiver (e.g., a radio). Electrical connectors (e.g., pads) are located along multiple edges of the first printed circuit board. The electrical connectors are in locations that correspond to a land pattern on a second printed circuit board. Along one edge of the first printed circuit board, the electrical connectors also correspond to electrical connections in a socket. For certification testing, for example, the device can be plugged into a socket. For installation in a host device, the device can be soldered down to the second printed circuit board.

Patent Claims

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Patent Metadata

Filing Date

July 2, 2010

Publication Date

July 8, 2014

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Cite as: Patentable. “Module that can be used as a plug-in module and as a solder-down module” (US-8774734). https://patentable.app/patents/US-8774734

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