Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A cooling apparatus comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; and a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions.
2. The cooling apparatus of claim 1 , wherein the two-phase surface enhancement features comprise micro- and/or nano-features.
3. The cooling apparatus of claim 2 , wherein the micro- and/or nano-features are pillars.
4. The cooling apparatus of claim 1 , wherein the two-phase surface enhancement features are defined by roughened portions of the target surface.
5. The cooling apparatus of claim 4 , wherein the roughened portions are laser roughened, chemically roughened, or mechanically roughened.
6. The cooling apparatus of claim 1 , wherein the two-phase surface enhancement features comprise a film applied to the target surface.
7. The cooling apparatus of claim 6 , wherein the film comprises micro- and/or nano-features.
8. The cooling apparatus of claim 1 , wherein: the jet orifice is cross-shaped; the single-phase surface enhancement features are arranged in four groups of single-phase surface enhancement features; the two-phase surface enhancement features are arranged in four regions of two-phase surface enhancement features; and the four groups of single-phase surface enhancement features and the four regions of two-phase enhancement features alternate about the impingement region of the target surface.
9. The cooling apparatus of claim 8 , wherein the four regions of two-phase enhancement features are arranged at a perimeter of the target surface.
10. The cooling apparatus of claim 8 , wherein: the four groups of single-phase surface enhancement features radially extend from the impingement region; and individual groups of the four groups of single-phase surface enhancement features are arranged at ninety degrees with respect to adjacent groups of single-phase surface enhancement features.
11. The cooling apparatus of claim 10 , wherein each group of single-phase surface enhancement features comprise a plurality of thermally conductive fins.
12. The cooling apparatus of claim 11 , wherein: the plurality of thermally conductive fins comprises a center thermally conductive fin; and a length of individual thermally conductive fins decrease in directions away from the center thermally conductive fin.
13. The cooling apparatus of claim 1 , wherein: the jet orifice has three circular lobes; the single-phase surface enhancement features are configured as a plurality of radially extending, thermally conductive fins; and the two-phase surface enhancement features are arranged in three regions of two-phase surface enhancement features.
14. The cooling apparatus of claim 13 , wherein the three regions of two-phase surface enhancement features are arranged at a perimeter of the target surface.
15. The cooling apparatus of claim 13 , wherein: a first region and a second region of the three regions of two-phase surface enhancement features are positioned at a first corner and a second corner of the target surface, respectively; and a third region of the three regions of two-phase surface enhancement features is positioned proximate an edge of the target surface opposite from the first corner and the second corner.
16. The cooling apparatus of claim 13 , wherein the single-phase surface enhancement features and the two-phase surface enhancement features are symmetrical about one axis.
17. The cooling apparatus of claim 1 , further comprising an intermediate substrate assembly thermally coupled to a heat transfer surface of the target layer.
18. The cooling apparatus of claim 17 , wherein the intermediate substrate layer comprises a directed bonded substrate assembly.
19. A power electronics module comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions; and a semiconductor device thermally coupled to the heat transfer surface.
20. A vehicle comprising a power electronics module, the power electronics module comprising: a jet channel; a jet plate surface comprising a jet orifice having a jet orifice geometry, wherein the jet orifice is in fluid communication with the jet channel and is configured to generate an impingement jet of a coolant fluid; a target layer comprising a target surface, single-phase surface enhancement features, and two-phase surface enhancement features, wherein: the target surface is configured to receive the impingement jet at an impingement region; the single-phase surface enhancement features are positioned on the target surface at high fluid velocity regions; and the two-phase surface enhancement features are positioned on the target surface at low fluid velocity regions; and a semiconductor device thermally coupled to the heat transfer surface.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 30, 2013
July 22, 2014
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