Image sensor module having image sensor package

1. An image sensor module, comprising: a circuit board having an upper surface and a lower surface, the circuit board having a window; an image sensor package including a mounting substrate and an image sensor chip mounted on the mounting substrate, the image sensor package being adhered to the lower surface of the circuit board such that the image sensor chip is exposed through the window; an optical system provided on the upper surface of the circuit board configured to guide light from an object to the image sensor chip; a plurality of conductive connection members respectively provided on a plurality of connection pads on an upper surface of the mounting substrate, wherein the image sensor package is electrically connected to the circuit board by the conductive connection members; a plurality of bonding pads electrically connecting the mounting substrate to the image sensor chip; a transparent member provided over the mounting substrate to cover the image sensor chip; a holder for supporting the transparent member, wherein the holder extends upwardly from the mounting substrate, the image sensor chip and plurality of bonding pads are arranged within the holder, and the plurality of conductive connection members are arranged outside of the holder, wherein the mounting substrate of the image sensor package includes a heat-dissipating substrate attached to a lower surface of a circuit substrate, and wherein the heat-dissipating substrate comprises a thermal conductive metal; and a heat-dissipating plate contacting a lower surface of the thermal conductive metal, and extending to contact the lower surface of the circuit board.

2. The image sensor module of claim 1 , wherein the transparent member is disposed over the image sensor chip within the window region of the circuit board.

3. The image sensor module of claim 1 , wherein the holder is disposed within the window region of the circuit board.

4. The image sensor module of claim 1 , wherein the transparent member has a shape corresponding to the image sensor chip.

5. The image sensor module of claim 1 , wherein the heat-dissipating substrate is attached to the circuit substrate using an adhesive film.

6. The image sensor module of claim 5 , wherein the heat-dissipating substrate does not include circuitry.

7. The image sensor module of claim 1 , wherein the image sensor chip includes an image sensor portion and a boundary portion surrounding the image sensor portion, the boundary portion including the plurality of bonding pads.

8. The image sensor module of claim 1 , wherein each of the conductive connection members comprises a conductive paste or a conductive ball.

9. The image sensor module of claim 1 , wherein the connection pads are arranged in a peripheral region of the mounting substrate.

10. The image sensor module of claim 1 , wherein an upper surface of the image sensor chip is positioned lower than the upper surface of the circuit board.

11. The image sensor module of claim 1 , wherein the heat-dissipating plate surrounds outer sides of the heat-dissipating substrate and the circuit substrate.

12. The image sensor module of claim 1 , further comprising a housing adhered to the upper surface of the circuit board to support the optical system.

13. A device comprising: a circuit board including an upper surface, a lower surface, and a window; an image sensor package including a mounting substrate and an image sensor chip covering a first portion of the mounting substrate, wherein an upper surface of the image sensor chip is exposed through the window; a transparent member provided over the mounting substrate to cover the image sensor chip; and a holder for supporting the transparent member, the holder located within the window, wherein a second portion of the mounting substrate is located outside of the first portion, the second portion electrically and physically connected to the circuit board at an upper surface of the mounting substrate, wherein the upper surface of the image sensor chip is located at a different height than the upper surface of the circuit board, and wherein an upper surface of the transparent member is located above the upper surface of the circuit board, and a lower surface of the transparent member is located between an upper-most surface of the holder and a lower-most surface of the holder.

14. The device of claim 13 , wherein both the holder and the transparent member are located within an area of the window.

15. The device of claim 13 , wherein the mounting substrate includes a circuit substrate, and further comprising: a heat dissipating element contacting a lower surface of the circuit substrate.

16. An image sensor module, comprising: a circuit board including a window; an image sensor mounting substrate including a first surface adhered to a lower surface of the circuit board, wherein an image sensor chip is mounted on the first surface of the image sensor mounting substrate; an optical system provided on an upper surface of the circuit board opposite the lower surface, wherein the image sensor chip is exposed through the window of the circuit board, and an upper surface of the image sensor chip is located at a lower height than the upper surface of the circuit board; and wherein the image sensor mounting substrate includes a circuit substrate and a heat dissipating substrate adhered to a lower surface of the circuit substrate; and a heat-dissipating plate contacting a lower surface of the heat-dissipating substrate and contacting the circuit board.

17. The image sensor module of claim 16 , further comprising: an adhesive film adhering the heat-dissipating substrate to the lower surface of the circuit substrate.