Patentable/Patents/US-8925186
US-8925186

System and method for picking and placement of chip dies

PublishedJanuary 6, 2015
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
5 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A component manipulator apparatus arranged for picking and placing of a component in a component assembly process, comprising: a Z-stroke arranged for component placement along a Z-axis relative to a placement position on a substrate; an actuation system arranged for aligning the component relative to the placement position; a pickup head arranged on the Z-stroke to pick up a component and place it on the placement position; and an alignment system coupled to the actuation system; wherein the alignment system comprises: an image detection system arranged on a first off-axis position (A) and arranged for receiving light from the placement position and the component; and an imaging system comprising an arc form concave spherical mirror arranged at a second off-axis position (B) and centered relative to the placement position; a folding mirror arranged in a light path between the concave spherical mirror and the placement position for folding the light path to a third off-axis position (C); and an arc form convex spherical mirror arranged at the third off-axis position (C) having a curvature to image the placement position and the component on the image detection system.

2

2. The component manipulator apparatus according to claim 1 , wherein the arc form of the concave spherical mirror and the concave spherical mirror, is semi-circular.

3

3. The component manipulator apparatus according to claim 1 , further comprising a semi-transparent mirror or beamsplitter cube, arranged in a light path between the image detection system and the placement position, so that the placement position and the component are imaged as substantially coinciding in the image detection system.

4

4. The component manipulator apparatus according to claim 1 , wherein a shutter is included in the light path to a center of the placement position.

5

5. The component manipulator apparatus according to claim 1 , wherein a shutter is included in the light path to the component, the component including a die.

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Patent Metadata

Filing Date

Unknown

Publication Date

January 6, 2015

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Cite as: Patentable. “System and method for picking and placement of chip dies” (US-8925186). https://patentable.app/patents/US-8925186

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