A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A wireless IC device comprising: a substrate including a first main surface and a second main surface facing the first main surface; a wireless IC element provided on a side of the first main surface and arranged to process a high-frequency signal; a first radiator including first and second ends, provided on a side of the second main surface, and coupled to the wireless IC element via a feeding circuit including a first interlayer conductor; and a second radiator including first and second ends, provided on the side of the first main surface, and coupled to the first radiator via a second interlayer conductor; wherein the wireless IC element is connected to the first end of the first radiator; the first end of the second radiator is connected to the second end of the first radiator; and the second end of the second radiator is not connected to the wireless IC element such that the second radiator is open.
2. The wireless IC device described in claim 1 , wherein the feeding circuit is loop-shaped, and the loop-shaped feeding circuit is coupled to the first radiator via a direct current or via an electromagnetic field.
3. The wireless IC device described in claim 2 , wherein the loop-shaped feeding circuit is coupled to the second radiator via an electromagnetic field.
4. The wireless IC device described in claim 2 , wherein the loop-shaped feeding circuit includes a loop surface that is perpendicular or substantially perpendicular to the first radiator and the second radiator.
5. The wireless IC device described in claim 2 , wherein the substrate is a child substrate mounted on a parent substrate, and the parent substrate is provided with an additional radiator coupled to the loop-shaped feeding circuit via an electromagnetic field.
6. The wireless IC device described in claim 1 , wherein at least one of the first radiator and the second radiator is loop-shaped.
7. The wireless IC device described in claim 6 , wherein at least one of the first radiator and the second radiator includes a portion including a slit.
8. The wireless IC device described in claim 1 , wherein the first radiator has a solid configuration, and the second radiator is configured in a loop shape, and an area inside a loop of the second radiator includes a region in which the first radiator and the second radiator do not overlap each other in a plan view.
9. The wireless IC device described in claim 1 , wherein a first ground electrode provided on the side of the second main surface of the substrate defines the first radiator, and a second ground electrode provided on the side of the first main surface of the substrate defines the second radiator.
10. The wireless IC device described in claim 1 , wherein the wireless IC element is a wireless IC chip arranged to process a high-frequency signal.
11. The wireless IC device described in claim 1 , wherein the wireless IC element includes a wireless IC chip arranged to process a high-frequency signal and a feeding circuit substrate which includes a feeding circuit having a predetermined resonant frequency.
12. The wireless IC device described in claim 1 , wherein the first and second radiators define antennas or ground electrodes of electronic components.
13. The wireless IC device described in claim 1 , wherein the substrate is a multilayer substrate including base layers laminated on each other; the first radiator is provided on a first of the base layers; the second radiator is provided on a second of the base layers; a third radiator is provided on a third of the base layers; the first, second and third radiators are loop-shaped and direct-current-coupled to each other.
14. The wireless IC device described in claim 1 , wherein the second radiator has a solid configuration, and the second radiator and the first radiator are direct-current-coupled by a plurality of the second interlayer conductors.
15. The wireless IC device described in claim 1 , wherein the second radiator is loop-shaped and includes a slit provided in a portion spaced away from the feeding circuit.
16. The wireless IC device described in claim 1 , wherein the substrate is a multilayer substrate including base layers laminated on each other; the first radiator is provided on a first of the base layers; the second radiator is provided on a second of the base layers located adjacent to feeding conductors of the feeding circuit; a third of the base layers is laminated between the first of the base layers and the second of the base layers; end portions of the feeding conductors are direct-current-coupled to opposite side portions of first end portions of the first radiator via the first interlayer conductor; and the second radiator is loop-shaped and includes a slit, and portions of the second radiator facing the slit are direct-current-coupled to second end portions of the first radiator via the second interlayer conductor.
17. The wireless IC device described in claim 1 , wherein the feeding circuit includes the first interlayer conductor and first, second and third feeding conductors located adjacent to each other in plan view and connected to each other via the first interlayer conductor; and the feeding circuit is coupled to the first radiator only by electromagnetic field coupling.
18. The wireless IC device described in claim 1 , wherein the second radiator is spaced away from first and second feeding conductors of the feeding circuit and the second radiator is coupled to the feeding circuit via the second interlayer conductor and the first radiator.
19. The wireless IC device described in claim 1 , wherein the first main surface of the substrate includes a cavity, and the wireless IC element is located in the cavity partially or completely.
20. A radio frequency identification system comprising the wireless IC device according to claim 1 .
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 10, 2013
February 3, 2015
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.