A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A modular system in package semiconductor device with a plurality of interconnect levels comprising: a first pre-assembled modular subassembly comprising: a planar leadframe with set of first leads; pads having attached electronic components; and a first set of elongated leads bent in a first direction away from the plane of the planar leadframe; a second planar leadframe with second set of leads and pads having attached electronic components; the bent leads of the first pre-assembled modular subassembly leadframe conductively connected to the second planar leadframe, forming a conductively linked 3-dimensional network between attached electronic components and sets of leads in two planes; and packaging material encapsulating portions of the 3-dimensional network.
2. The device of claim 1 wherein at least portions of the first and second leads are un-encapsulated by the packaging material, the un-encapsulated lead portions operable as electrical device terminals.
3. The device of claim 2 wherein the terminals are located in more than one plane of the device encapsulation.
4. The device of claim 2 further including a third planar leadframe with pads having attached electronic components, the third leadframe conductively connected to the second leadframe by bent elongated leads of a third set.
5. The device of claim 1 further including a second set of elongated leads of the first leadframe, the second set leads bent in a second direction away from the plane of the first leadframe, the second direction opposite to the first direction.
6. The device of claim 5 wherein leads of the third leadframe are suitable to be tied to external electrical terminals.
7. The device of claim 1 wherein the first pre-assembled modular subassembly leadframe is made of a first metal and the second leadframe is made of a second metal different from the first metal.
8. The device of claim 1 wherein the elongated leads have a geometry suitable to spread and dissipate heat.
9. The device of claim 1 wherein leads of the first pre-assembled modular subassembly leadframe are suitable to be tied to external electrical terminals.
10. The device of claim 1 wherein the electronic components include packaged and unpackaged active and passive semiconductor components, including heat-generating components.
11. The device of claim 10 wherein the passive components include inductors, capacitors, and resistors.
12. The device of claim 1 wherein the packaging material is configured to allow the attachment of a heat sink.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 22, 2013
February 3, 2015
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.