The bottom surface of a via drilled in a fiber-reinforced PCB is profiled interferometrically with acceptable precision using an objective with sufficiently large numerical aperture to illuminate the bottom under the fibers. The light scattering produced by the inherent roughness of the surface of the via bottom causes diffused light to return to the objective and yield reliable data fringes. Under such appropriate numerical-aperture and surface roughness conditions, the bottom surface of vias can be profiled correctly simply by segmenting the correlograms produced by the scan and processing all fringes that correspond to the bottom surface elevation.
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December 18, 2012
February 10, 2015
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