Semiconductor wafer holder and electroplating system for plating a semiconductor wafer

1. A semiconductor wafer holder for use in an electroplating apparatus having a holder transfer robot and a plating bath, said semiconductor wafer holder comprising: a first holding member having a first conductive element; a second holding member having a second conductive element and at least one annular packing having two projections, wherein said first and second holding members are provided for holding a semiconductor wafer therebetween, wherein, said first and second holding members hold the semiconductor wafer therebetween, and one of said two projections contacts a surface of said first holding member and another of said two projections contacts a surface of the semiconductor wafer, said two projections defining a sealed hole therebetween that is sealed from an electroplating solution, and said second conductive element being located in the sealed hole, wherein, said first and second holding members hold the semiconductor wafer therebetween, and said first conductive element is configured to supply electricity to said second conductive element and said second conductive element is configured to supply the electricity from said first conductive element to the semiconductor wafer, wherein said semiconductor wafer holder is configured to be transferred by the holder transfer robot to and from the plating bath, and wherein said second conductive element is free from contact with said at least one annular packing.

2. A semiconductor wafer holder according to claim 1 , wherein said first and second conductive elements are in direct contact with each other when said semiconductor wafer holder is holding the semiconductor wafer.

3. A semiconductor wafer holder according to claim 1 , wherein, when said first and second holding members are holding the semiconductor wafer therebetween, said at least one annular packing seals a peripheral edge of one side of the semiconductor wafer, an opposite side of the semiconductor wafer, and said first and second conductive elements from the electroplating solution.

4. A semiconductor wafer holder according to claim 1 , wherein said second conductive element resiliently contacts the semiconductor wafer.

5. A semiconductor wafer holder according to claim 1 , wherein said first and second holding members each comprise an electrically insulative material.

6. A semiconductor wafer holder according to claim 1 , wherein said first holding member has a recess within which the semiconductor wafer is placed.

7. A semiconductor wafer holder according to claim 1 , wherein adjacent surfaces of said second conductive element and said at least one annular packing have space therebetween.