A silicon carbide semiconductor element and a manufacturing method thereof are disclosed in which a low contact resistance is attained between an electrode film and a wiring conductor element, and the wiring conductor element is hardly detached from the electrode film. In the method, a nickel film and a nickel oxide film are laminated in this order on a surface of an n-type silicon carbide substrate or an n-type silicon carbide region of a silicon carbide substrate, followed by a heat treatment under a non-oxidizing condition. The heat treatment transforms a portion of the nickel film into a nickel silicide film. Then, the nickel oxide film is removed with hydrochloric acid solution, and subsequently, a nickel aluminum film and an aluminum film are laminated in this order on a surface of the nickel silicide film.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A silicon carbide semiconductor element comprising: an n-type silicon carbide substrate or a silicon carbide substrate having an n-type silicon carbide region in a surface region thereof; a nickel silicide film formed directly on a surface of the n-type silicon carbide substrate or directly on a surface of the n-type silicon carbide region of a silicon carbide substrate; a nickel aluminum film having a thickness in a range of 5 nm to 20 nm formed on the nickel silicide film and having a composition of 50% nickel and 50% aluminum in order to enhance adhesiveness between the nickel silicide film and the aluminum film and to prevent the resistance of the nickel aluminum film from rising; and an aluminum film having a thickness in a range of 2 μm to 4 μm formed on a surface of the nickel aluminum film the nickel silicide film being formed by heat treatment of a nickel film on the n-type silicon carbide substrate or the silicon carbide substrate having an n-type silicon carbide region, the nickel silicide film having a thickness in a range of 0.05 μm to 4 μm.
2. A silicon carbide device comprising the silicon carbide semiconductor element defined by claim 1 , wherein the nickel silicide, nickel aluminum film and aluminum film constitute an ohmic electrode.
3. A silicon carbide semiconductor element comprising: an n-type silicon carbide substrate or a silicon carbide substrate having an n-type silicon carbide region in a surface region thereof; a nickel silicide film formed directly on a surface of the n-type silicon carbide substrate or directly on a surface of the n-type silicon carbide region of a silicon carbide substrate; a nickel aluminum film having a thickness in a range of 5 nm to 20 nm formed on the nickel silicide film, without the presence of carbon precipitates between the nickel silicide film and the nickel aluminum film; and an aluminum film having a thickness in a range of 2 μm to 4 μm formed on a surface of the nickel aluminum film the nickel silicide film being formed by heat treatment of a nickel film on the n-type silicon carbide substrate or the silicon carbide substrate having an n-type silicon carbide region, the nickel silicide film having a thickness in a range of 0.05 μm to 4 μm.
4. A silicon carbide device comprising the silicon carbide semiconductor element defined by claim 3 , wherein the nickel silicide, nickel aluminum film and aluminum film constitute an ohmic electrode.
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January 10, 2012
August 25, 2015
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