Aspects of a method and system for a configurable antenna in an integrated circuit package are provided. In a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, one or more antenna parameters may be adjusted by configuring a plurality of antenna elements via one or more switching elements. In this regard, the antenna elements and/or the switching elements may be within and/or on the multi-layer package and/or within the integrated circuit. The switching elements may be MEMS switches on and/or within the IC and/or the multi-layer package. The IC may be bonded or mounted to the underside of the package and signals may be communicated between the IC and the package via one or more solder balls. The IC may comprise suitable logic, circuitry, and/or code for configuring the antenna elements. The antenna elements may be configured based on desired polarization, antenna gain, and/or frequency.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An integrated circuit package comprising: a plurality of antenna elements disposed on a first side of an insulating material; a plurality of switching elements disposed on a side of the insulating material opposite to the first side and connected to the plurality of antenna elements through a plurality of vias, the switching elements being configured to selectively interconnect the plurality of antenna elements; and a circuit to control activation of one or more of the plurality of switching elements, wherein said circuit is coupled to said plurality of antenna elements through a plurality of solder balls, the plurality of switching elements and the plurality of vias.
2. The integrated circuit package of claim 1 , wherein said switching elements are micro-electro-mechanical switches.
3. The integrated circuit package of claim 1 , wherein the circuit is mounted to the underside of said integrated circuit package.
4. The integrated circuit of claim 1 , wherein said antenna elements are selectively interconnected based on a desired polarization of at least one of received and transmitted signals.
5. The integrated circuit package of claim 1 , wherein said antenna elements are selectively interconnected based on a desired frequency band of at least one of received and transmitted signals.
6. The integrated circuit package of claim 1 , wherein said integrated circuit package comprises one or more layers including ferromagnetic material.
7. The integrated circuit package of claim 1 , wherein the circuit selectively interconnects the plurality of antenna element into an overall antenna shape by activation of the one or more switching elements.
8. The integrated circuit package of claim 1 , wherein the circuit steps through all combinations of the plurality of antenna elements by activation of corresponding ones of the plurality of switching elements, and selects a combination of the plurality of antenna elements based on received signal strength.
9. An integrated circuit package comprising: a plurality of antenna elements disposed on a first side of an insulating material; a plurality of switching elements disposed on a side of the insulating material opposite the first side and connected to the plurality of antennal elements through a plurality of vias, the plurality of switching elements being configured to selectively interconnect said plurality of antenna elements; and a circuit to control activation of one or more of the plurality of switching elements, wherein said plurality of antenna elements are on said integrated circuit package, and said circuit is coupled to said plurality of antenna elements through a plurality of solder balls, the plurality of switching elements and the plurality of vias.
10. The integrated circuit package of claim 9 , wherein said switching elements are micro-electro-mechanical switches.
11. The integrated circuit package of claim 9 , wherein said circuit is mounted to the underside of said integrated circuit package.
12. The integrated circuit package of claim 9 , wherein said antenna elements are selectively interconnected on a desired polarization of at least one of received and transmitted signals.
13. The integrated circuit package of claim 9 , wherein said antenna elements are selectively interconnected based on a desired antenna gain.
14. The integrated circuit package of claim 9 , wherein said antenna elements are selectively interconnected based on a desired frequency band of at least one of received and transmitted signals.
15. The integrated circuit package of claim 9 , wherein said integrated circuit package comprises one or more layers including ferromagnetic material.
16. An integrated circuit package comprising: a plurality of antenna elements disposed on a first side of an insulating material; a plurality of switching elements disposed on a side of the insulating material opposite to the first side and connected to the plurality of antenna elements through a plurality of vias, the switching elements being configured to selectively, the plurality of switching elements being configured to to selectively interconnect the plurality of antenna elements; and a circuit to control activation of one or more of the plurality of switching elements, wherein said one or more switching elements are on said integrated circuit package, and said circuit is coupled to said plurality of antenna elements through a plurality of solder balls, the switching elements and the plurality of vias.
17. The integrated circuit package of claim 16 , wherein said switching elements are micro-electro-mechanical switches.
18. The integrated circuit package of claim 16 , wherein said antenna elements are selectively interconnected based on a desired polarization of at least one of received and transmitted signals.
19. The integrated circuit package of claim 16 , wherein said antenna elements are selectively interconnected based on a desired antenna gain.
20. The integrated circuit package of claim 16 , wherein said integrated circuit package comprises one or more layers including ferromagnetic material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 3, 2012
August 25, 2015
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