A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The resin as claimed in claim 1 , wherein the ratio (Si—H/Si-Vi) is about 1.05 to about 1.15.
4. The resin as claimed in claim 1 , wherein: the first polysiloxane is included in an amount of less than about 50 wt % based on the total amount of the resin, and the second polysiloxane is included in an amount of more than about 50 wt % based on the total amount of the resin.
5. The resin as claimed in claim 4 , wherein the second polysiloxane is included in an amount of about 65 wt % to about 99 wt % based on the total amount of resin.
6. The resin as claimed in claim 1 , wherein the first polysiloxane has a weight average molecular weight of about 100 g/mol to about 10,000 g/mol.
7. The resin as claimed in claim 6 , wherein the first polysiloxane has a weight average molecular weight of about 100 g/mol to about 3,000 g/mol.
8. The resin as claimed in claim 1 , wherein the second polysiloxane has a weight average molecular weight of about 1,000 g/mol to about 100,000 g/mol.
9. The resin as claimed in claim 8 , wherein the second polysiloxane has a weight average molecular weight of about 1,000 g/mol to 20,000 g/mol.
10. The resin as claimed in claim 1 , further comprising a hydrosilation catalyst.
11. A transparent encapsulation material prepared by curing the resin of claim 1 .
12. The encapsulation material as claimed in claim 11 , wherein the encapsulation material exhibits a light transmittance decrease ratio (ΔT) of less than about 15% after heating at about 120° C. for about 500 hours.
13. The encapsulation material as claimed in claim 11 , wherein the encapsulation material exhibits a light transmittance decrease ratio (ΔT) of less than about 15% after heating at about 180° C. for about 150 hours.
14. The encapsulation material as claimed in claim 11 , wherein the encapsulation material exhibits a tackiness of less than about 100 kgf.
15. An electronic device comprising the transparent encapsulation material of claim 11 .
16. The electronic device as claimed in claim 15 , wherein the electronic device includes one or more of a light emitting diode, an organic light emitting device, a photo luminescent device, and a solar cell.
17. A method of manufacturing an electronic device, the method comprising: providing an element that receives and/or emits light, the element including one or more of a light emitting diode, an organic light emitting device, a photo luminescent device, and a solar cell; at least partially covering the element with a resin, wherein the resin is the resin as claimed in claim 1 ; and curing the resin to form a transparent material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
August 8, 2014
September 29, 2015
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