In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups of nanotubes over a substrate, wherein the groups of nanotubes may be arranged such that a portion of the substrate is exposed and forming metal over the exposed portion of the substrate between the plurality of groups of nanotubes.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for manufacturing a metallization layer on a substrate, the method comprising: forming an adhesion promoting layer on the substrate; providing a separate substrate with fully grown nanotubes; transferring the full grown nanotubes from the separate substrate onto the adhesion promoting layer; forming a plurality of groups of nanotubes from the nanotubes transferred from the separate substrate over the substrate, wherein the groups of nanotubes are arranged such that a portion of the substrate is exposed; and forming metal over the exposed portion of the substrate between the groups of nanotubes.
2. The method of claim 1 , wherein each group of nanotubes comprises insulating material between the nanotubes.
3. The method of claim 1 , wherein forming the plurality of groups of nanotubes over the substrate comprises: providing a uniform arrangement of nanotubes; depositing an insulating material therebetween; removing a multitude of nanotubes together with the insulating material deposited therebetween.
4. The method of claim 1 , wherein the plurality of groups of nanotubes comprise carbon nanotubes.
5. The method of claim 3 , wherein removing the multitude of nanotubes together with insulating material deposited therebetween comprises a plasma etch process.
6. The method of claim 1 , further comprising: structuring the adhesion promoting layer before transferring the fully grown nanotubes.
7. The method of claim 1 , wherein the nanotubes in the plurality of groups of nanotubes arranged over the substrate are substantially extending at right angle with respect to the substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 30, 2014
October 13, 2015
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