A comprehensive light-emitting diode device including a translucent substrate, a light-emitting diode chip, a reflective layer, a first wavelength conversion layer, and a second wavelength conversion layer. The translucent substrate includes a first surface and a second surface opposite to the first surface. The light-emitting diode chip is disposed on the first surface. The reflective layer is disposed on the first surface. The light-emitting diode chip is surrounded by the reflective layer. The first wavelength conversion layer is disposed on the first surface. The light-emitting diode chip and the reflective layer are covered by the first wavelength conversion layer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A comprehensive light-emitting diode device, comprising: a translucent substrate comprising a first surface and a second surface opposite to the first surface; a light-emitting diode chip disposed on the first surface; a reflective layer disposed on the first surface and the light-emitting diode chip being surrounded by the reflective layer, wherein a distance between the light-emitting diode chip and the reflective layer is 50 to 100 μm; a first wavelength conversion layer disposed on the first surface, and the light-emitting diode chip and the reflective layer being covered by the first wavelength conversion layer; and a second wavelength conversion layer disposed on the second surface, wherein a vertical projection of the light-emitting diode chip is located in an area of the second wavelength conversion layer.
2. The comprehensive light-emitting diode device of claim 1 , wherein the light-emitting diode chip has a first height relative to the first surface, the reflective layer has a second height relative to the first surface, and the first height is greater than the second height.
3. The comprehensive light-emitting diode device of claim 1 , wherein the first wavelength conversion layer is an encapsulant comprising a wavelength conversion material.
4. The comprehensive light-emitting diode device of claim 3 , wherein the wavelength conversion material is selected from the groups consisting of a fluorescent powder, a pigment, a dyeware, and combinations thereof.
5. A lighting module, comprising: a translucent substrate comprising a first surface and a second surface opposite to the first surface; a plurality of light-emitting diode chips disposed on the first surface; a plurality of reflective layers disposed on the first surface, wherein each of the reflective layers is ring-shaped, and each of the light-emitting diode chips is surrounded by the corresponding reflective layer; a first wavelength conversion layer disposed on the first surface, and the light-emitting diode chips and the reflective layer being covered by the first wavelength conversion layer; a second wavelength conversion layer disposed on the second surface, wherein a vertical projection of each of the light-emitting diode chips is located in an area of the second wavelength conversion layer; a first electrode disposed on the first surface and electrically connected with the light-emitting diode chips; and a second electrode disposed on the first surface and electrically connected with the light-emitting diode chips.
6. The lighting module of claim 5 , wherein a distance between each of the light-emitting diode chips and the corresponding reflective layer is 50 to 100 μm.
7. The lighting module of claim 5 , wherein each of the light-emitting diode chips has a first height relative to the first surface, the reflective layer has a second height relative to the first surface, and the first height is greater than the second height.
8. The lighting module of claim 7 , wherein the reflective layer has a plurality of hollow portions, and each of the light-emitting diode chips is surrounded by the corresponding hollow portion.
9. The lighting module of claim 8 , wherein a distance between each of the light-emitting diode chips and an inner edge of the corresponding hollow portion is 50 to 100 μm.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 9, 2014
October 20, 2015
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