According one embodiment, a pattern formation method forming a resist layer on a pattern formation surface by pressing a template provided with a concave-convex from above the resist layer to form a resist pattern on the pattern formation surface, includes: forming a resist layer in a first region having an area smaller than an area of the pattern formation surface and in a second region other than the first region of the pattern formation surface; pressing a template against the resist layer; irradiating the resist layer with light via the template to form a first resist layer in the first region, curing of the first resist layer being suppressed, and form the resist pattern including a second resist layer, curing of the second resist layer proceeds in the second region; and removing the first resist layer from the first region, the curing of the first resist layer being suppressed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A pattern formation apparatus forming a resist pattern on a pattern formation surface by pressing a template against a resist layer formed on the pattern formation surface, the template having a concave-convex, the apparatus comprising: a first module configured to form the resist layer in a first region and a second region on the pattern formation surface, the first region being smaller than the second region, the first region being provided at a peripheral portion of the pattern formation surface; a second module configured to press the template against the resist layer; a third module configured to irradiate the resist layer with light via the template to form the resist pattern including a first resist layer in the first region and a second resist layer in the second region, curing of the first resist layer being suppressed, and curing of the second resist layer proceeds; a fourth module configured to remove the first resist layer from the first region; and a fifth module configured to suppress curing of the first resist layer before or while irradiating the resist layer with the light.
2. The apparatus according to claim 1 , wherein the fifth module includes a module configured to supply to the first region a chemical liquid suppressing curing of the resist layer before the template is pressed against the resist layer.
3. The apparatus according to claim 2 , wherein the chemical liquid contains an oxygen generator.
4. The apparatus according to claim 2 , wherein the chemical liquid is supplied to the first region by an application method.
5. The apparatus according to claim 2 , wherein a droplet the chemical liquid is supplied to the first region by dropping the chemical liquid.
6. The apparatus according to claim 1 , wherein the fifth module includes a module configured to supply an oxygen-containing gas to the resist layer formed in the first region while the resist layer is irradiated with the light.
7. The apparatus according to claim 6 , wherein the module configured to supply the oxygen-containing gas supplies the oxygen-containing gas to the resist layer via the template.
8. The apparatus according to claim 6 , wherein the module configured to supply the oxygen-containing gas supplies the oxygen-containing gas to the resist layer via between the template and the resist layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 30, 2013
February 16, 2016
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