Methods for releasing a device substrate temporarily bonded by a bonding layer to a carrier substrate. A dissolution head is engaged with the carrier substrate and a first dissolution process is performed to partially remove the bonding layer. After the first dissolution process is completed, the dissolution head is disengaged from the carrier substrate, and then re-engaged with the carrier substrate. In response to re-engaging the dissolution head with the carrier substrate, a second dissolution process is performed to further remove the bonding layer remaining after the first dissolution process.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for releasing a device substrate temporarily bonded by a bonding layer to a carrier substrate, the method comprising: engaging a dissolution head with the carrier substrate; in response to engaging the dissolution head with the carrier substrate, performing a first dissolution process to partially remove the bonding layer; in response to completion of the first dissolution process, disengaging the dissolution head from the carrier substrate; re-engaging the dissolution head with the carrier substrate; and in response to re-engaging the dissolution head with the carrier substrate, performing a second dissolution process to further remove the bonding layer remaining after the first dissolution process, wherein the first dissolution process occurs over a first time period, the second dissolution process occurs over a second time period that differs from the first time period, and the second time period is at least 50% longer than the first time period.
2. The method of claim 1 wherein the first dissolution process removes the bonding layer by the same mechanism as the second dissolution process.
3. The method of claim 1 wherein the first time period is 30 seconds, and the second time period is 90 seconds.
4. The method of claim 1 wherein the bonding layer is located between the carrier substrate and the device substrate, and the carrier substrate includes passageways defining flow paths for a liquid chemical agent to the bonding layer.
5. The method of claim 1 wherein the bonding layer is removed with a liquid chemical agent, and performing the first dissolution process to partially remove the bonding layer comprises: delivering the liquid chemical agent to the bonding layer with the dissolution head to expose the bonding layer to the liquid chemical agent and thereby provide the first dissolution process.
6. The method of claim 5 wherein performing the second dissolution process to further remove the bonding layer comprises: delivering the liquid chemical agent to the bonding layer with the dissolution head to further expose the bonding layer to the liquid chemical agent and thereby provide the second dissolution process.
7. The method of claim 6 wherein the liquid chemical agent is delivered to the bonding layer over the first time period during the first dissolution process, and the liquid chemical agent is delivered to the bonding layer over the second time period during the second dissolution process.
8. The method of claim 6 wherein performing the second dissolution process to further remove the bonding layer further comprises: transferring ultrasonic energy to the liquid chemical agent during the first dissolution process.
9. The method of claim 5 wherein the liquid chemical agent is delivered to the bonding layer over the first time period during the first dissolution process, and further comprising: applying suction to vacuum the liquid chemical agent from the dissolution head over the first time period; in response to the first time period concluding, discontinuing the delivery of the liquid chemical agent; and while the delivery is discontinued, continuing the application of suction to vacuum residual amounts of the liquid chemical agent from the dissolution head.
10. The method of claim 9 wherein the suction is applied through a plurality of ports in the dissolution head, and further comprising: discontinuing the application of suction so that the liquid chemical agent remaining in the ports backflows onto location portions of the bonding layer.
11. The method of claim 5 wherein performing the first dissolution process to partially remove the bonding layer further comprises: transferring ultrasonic energy to the liquid chemical agent during the first dissolution process.
12. The method of claim 1 wherein engaging the dissolution head with the carrier substrate comprises: moving the dissolution head into a first contacting relationship with the carrier substrate to form a chamber between the dissolution head and the carrier substrate.
13. The method of claim 12 wherein the first contacting relationship is provided by compressing a sealing member carried by the dissolution head, and disengaging the dissolution head from the carrier substrate comprises: moving the dissolution head such that the sealing member is separated from the carrier substrate.
14. The method of claim 1 wherein the first and second dissolution processes are effective to completely remove the bonding layer.
15. The method of claim 1 further comprising: in response to completion of the second dissolution process, disengaging the dissolution head from the carrier substrate; re-engaging the dissolution head with the carrier substrate; and in response to re-engaging the dissolution head with the carrier substrate, performing a third dissolution process to further remove the bonding layer remaining after the second dissolution process.
16. The method of claim 1 wherein the first and second dissolution processes each expose the bonding layer to a liquid chemical agent capable of dissolving a material of the bonding layer.
17. The method of claim 16 wherein the bonding layer is comprised of an adhesive, and the liquid chemical agent is a solvent capable of dissolving the adhesive.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 3, 2014
May 10, 2016
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