An image pickup apparatus in which an imaging sensor package reflow mounted in advance to a circuit board can be fixed to a fixture member of the image pickup apparatus. A sensor holder of a digital video camera as an image pickup apparatus has a holder body that is positioned to surround an imaging sensor package mounted to a sensor board as a circuit board. Flange portions of the sensor holder are formed to project from a rear end surface of the holder body toward a heat radiation plate having a flat plate shape. The heat radiation plate is fixed to a lens barrel in a state that the flange portions are held between the lens barrel and the heat radiation plate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. An image pickup apparatus comprising: an imaging sensor package; a circuit board on which the imaging sensor package is mounted; a heat radiation member disposed on a side of the circuit board opposite from a side thereof on which the imaging sensor package is mounted; a holder member disposed in front of the imaging sensor package and configured to hold the imaging sensor package; and a fixture member disposed in front of the holder member and configured to be fixed with the heat radiation member, wherein the imaging sensor package and the circuit board are sandwiched between the holder member and the heat radiation member, wherein the holder member is positioned to the fixture member, wherein the holder member has a holder body which surrounds at least a peripheral side of the imaging sensor package and a flange portion formed integrally with the holder body, and wherein the flange portion projects from the holder body toward the heat radiation member, and wherein the holder member is adhered to the circuit board by adhesive applied across a part of the holder body where the flange portion is not formed and a surface of the circuit board where the imaging sensor package is mounted.
2. The image pickup apparatus according to claim 1 , wherein a gap is provided between the holder body and the circuit board such that the holder body is not in contact with the circuit board, and wherein the holder body has a groove into which the adhesive flowing into inside of the holder body is guided.
3. The image pickup apparatus according to claim 1 , wherein a cut out portion is formed at a portion of the circuit board that faces the flange portion, and wherein the flange portion extending through the cut out portion is in contact with the heat radiation member.
4. The image pickup apparatus according to claim 1 , wherein a signal processing IC is mounted on the side of the circuit board opposite from the side thereof on which the imaging sensor package is mounted, and wherein the signal processing IC and the heat radiation member are thermally connected with each other.
5. The image pickup apparatus according to claim 1 , wherein a screw insertion hole is formed in the heat radiation member and in the flange portion in an optical axis direction, wherein a threaded screw hole for thread engagement with screw that is inserted through the screw insertion hole is formed in the fixture member in the optical axis direction and in alignment with the screw insertion hole, and wherein the threaded screw hole is provided within ranges from abutment surface between the flange portion and the fixture member to a front end surface of the holder member.
6. The image pickup apparatus according to claim 1 , wherein the imaging sensor package has an image sensing device, and wherein the fixture member is a lens barrel in which there is disposed an imaging optical system configured to form an object image on the image sensing device.
7. The image pickup apparatus according to claim 1 , wherein a first positioning portion is provided on the flange portion, wherein a second positioning portion is provided on the fixture member, and wherein the holder member is positioned to the fixture member by engaging the first and second positioning portion with each other.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 14, 2012
July 5, 2016
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