A method of forming a strained trampoline including: forming a strain inducing layer on a semiconductor-on-insulator (SOI), the SOI having a semiconductor layer on an insulator layer and the insulator layer is on a handle substrate; forming a opening through the semiconductor layer and the insulator layer using a patterned hardmask; forming a trampoline support in the opening; forming a trench through the strain inducing layer and through the semiconductor layer exposing a portion of the insulator layer, a strained trampoline is a portion of the semiconductor layer with a boundary defined by the trampoline support and the trench; and removing the insulator layer through the trench, where the strained trampoline is supported by the trampoline support.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method comprising: forming a strain inducing layer on a semiconductor-on-insulator (SOI), the SOI is a semiconductor layer, an insulator layer, and a handle substrate, wherein the semiconductor layer is on the insulator layer and the insulator layer is on the handle substrate, the strain inducing layer is a material with a different atomic alignment than the atomic alignment of the semiconductor layer, wherein the strain inducing layer places a strain on the semiconductor layer; forming a hardmask on the strain inducing layer; patterning the hardmask; forming a opening through the semiconductor layer and through the insulator layer using the patterned hardmask as a mask; forming a trampoline support in the opening; forming a trench through the strain inducing layer and through the semiconductor layer, the trench exposes a portion of the insulator layer, the trench is adjacent to the trampoline support, the semiconductor layer comprises a strained trampoline with a boundary defined by the trampoline support and the trench; and removing the insulator layer from beneath the strained trampoline through the trench, wherein the strained trampoline is supported by the trampoline support, wherein the trampoline support extends an entire side of the strained trampoline, wherein the strained trampoline is bordered on opposite sides by two trampoline supports and is bordered on adjacent sides by the trench, the trampoline supports and the trench define an entire boundary of the strained trampoline.
2. The method of claim 1 , further comprising: removing the strain inducing layer; and polishing the trampoline support to a top surface of the strained trampoline.
3. The method of claim 1 , further comprising: forming a flowable oxide underneath the strained trampoline after removal of the insulator layer.
4. The method of claim 1 , further comprising: forming a trench fill in the trench after removal of the insulator layer.
5. The method of claim 1 , wherein the trampoline support extends onto the handle substrate.
6. The method of claim 1 , wherein the semiconductor layer is silicon and the strain inducing layer is silicon germanium.
7. The method of claim 1 , wherein the trampoline support provides four trampoline supports that surround the strained trampoline.
8. A method comprising: forming a strain inducing layer on a silicon-on-insulator (SOI), the SOI is a silicon layer, a buried oxide (BOX) layer, and a handle substrate, wherein the silicon layer is on the BOX layer and the BOX layer is on the handle substrate; forming an opening through the silicon layer and through the BOX layer; forming a trampoline support in the opening; forming a trench in through the silicon layer and through the BOX layer, the trench is adjacent to the trampoline support, the silicon layer comprises a strained silicon trampoline with a boundary defined by the trampoline support and the trench; and removing the BOX layer from beneath the strained silicon trampoline wherein the trampoline support extends an entire side of the strained silicon trampoline, wherein the strained silicon trampoline is bordered on opposite sides by two trampoline supports and is bordered on adjacent sides by the trench, the trampoline supports and the trench define an entire boundary of the strained silicon trampoline.
9. The method of claim 8 , further comprising: removing the strain inducing layer; and polishing the trampoline support to a top surface of the silicon layer.
10. The method of claim 8 , further comprising: forming a flowable oxide underneath the silicon layer through the trench after removal of the BOX layer.
11. The method of claim 8 , further comprising: forming a trench fill in the trench after removal of the BOX layer.
12. The method of claim 8 , wherein the trampoline support extends onto the handle substrate.
13. The method of claim 8 , wherein the strain inducing layer is silicon germanium.
14. The method of claim 8 , wherein the trampoline support provides four trampoline supports that surround the strained silicon trampoline.
15. A structure comprising: a strained trampoline comprising a silicon layer that is strained, having been formed on a sacrificial strain inducing layer of silicon germanium which has been removed, the strained trampoline physically held in a strained state by a trampoline support, the strained trampoline is vertically suspended by the trampoline support, wherein the strained trampoline is bordered on opposite sides by two trampoline supports and is bordered on adjacent sides by a trench, the trampoline supports and the trench define an entire boundary of the strained trampoline; and a handle substrate physically supporting the trampoline support.
16. The structure of claim 15 , wherein the trampoline support is a silicon.
17. The structure of claim 15 , wherein the trampoline support provides four trampoline supports that surround the strained trampoline.
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September 11, 2014
July 12, 2016
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