A method for manufacturing a semiconductor device by using underfill material includes: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent; and a reflow step configured to solder-bond the semiconductor chip and the substrate by a reflow furnace. The film forming resin of the underfill material has a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, and accordingly, the viscosity at the time of heat melting can be reduced, and a semiconductor chip can be mounted at a low pressure.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of manufacturing a semiconductor device comprising: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent, wherein the film forming resin is a tri-block copolymer of p-hydroxystyrene and ethyl vinyl ether; and a reflow step configured to solder-bond the above-mentioned semiconductor chip and the above-mentioned substrate by a reflow furnace.
2. An underfill material, comprising: a film forming resin having a weight average molecular weight of not more than 30000 g/mol, and a molecular weight distribution of not more than 2.0; an epoxy resin; and an epoxy curing agent; wherein the film forming resin is a tri-block copolymer of p-hydroxystyrene and ethyl vinyl ether.
3. The underfill material according to claim 2 , wherein the epoxy curing agent is an acid anhydride.
4. The underfill material according to claim 2 , wherein a composition ratio of the p-hydroxystyrene to the ethyl vinyl ether (p-hydroxystyrene/ethyl vinyl ether) is not less than 20/80 and not more than 70/30, and not less than 15 parts by mass and not more than 90 parts by mass of the epoxy curing agent with respect to 100 parts by mass of epoxy resin are blended.
5. The underfill material according to claim 2 , wherein a composition ratio of the p-hydroxystyrene to the ethyl vinyl ether (p-hydroxystyrene/ethyl vinyl ether) is not less than 30/70 and not more than 50/50, and not less than 40 parts by mass and not more than 70 parts by mass of the epoxy curing agent with respect to 100 parts by mass of epoxy resin are blended.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 19, 2014
September 6, 2016
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