The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A tape comprising: a circuit pattern region having a circuit pattern formed on a base film; and a convey region including sprocket holes formed at both sides of the base film and a line type metal pattern on a top surface of the base film, wherein a thickness of the base film in a region where the base film is exposed in the circuit pattern region and a thickness of the base film in a region where the base film is exposed in the convey region are both thinner than that of a region where the base film is not exposed in the circuit pattern region and in the convey region, wherein the top surface of the base film in the region where the base film is exposed in the convey region lies in a first plane, and the top surface of the base film in the region where the base film is not exposed in the convey region lies in a second plane different from the first plane, wherein the metal pattern is disposed on the top surface of the base film in the region where the base film is not exposed in the convey region, wherein the top surface of the base film has a concave portion in the circuit pattern region where the base film is exposed, and wherein the base film is an insulating film.
2. The tape of claim 1 , wherein the metal pattern is disposed along or parallel to an imaginary line passing through a center of each sprocket hole that is on a same side of the circuit pattern region as the metal pattern is.
3. The tape of claim 1 , wherein the metal pattern is adjacent to the sprocket holes.
4. The tape of claim 1 , wherein the metal pattern is disposed adjacent to a first sprocket hole and at a predetermined distance separated from the first sprocket hole.
5. The tape of claim 1 , wherein the metal pattern is disposed between adjacent sprocket holes among the sprocket holes.
6. The tape of claim 1 , comprising at least two metal patterns.
7. The tape of claim 1 , wherein the metal pattern is disposed at both sides of the sprocket holes, respectively.
8. The tape of claim 1 , wherein the metal pattern is formed to surround each of edge parts of the sprocket holes.
9. The tape of claim 1 , wherein the thickness of the base film in the region where the base film is exposed in the circuit pattern region is thinner than that of the region where the base film is not exposed in the circuit pattern region.
10. The tape of claim 1 , wherein the thickness of the base film in the region where the base film is exposed in the convey region is thinner than that of the region where the base film is not exposed in the convey region.
11. The tape of claim 1 , wherein the thickness of the base film in the region where the base film is exposed in the circuit pattern region is thinner than that of the region where the base film is not exposed in the circuit pattern region, and wherein the thickness of the base film in the region where the base film is exposed in the convey region is thinner than that of the region where the base film is not exposed in the convey region.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 22, 2011
October 25, 2016
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